MacDermid Alpha Electronics Solutions will showcase a portfolio of advanced materials and process technologies aimed at improving reliability, manufacturing consistency, and performance in increasingly complex electronic systems at Productronica India 2026.
The company will exhibit at the Bangalore International Exhibition Centre in Bengaluru from September 16 to 18, with its technical experts available at Booth H4.G35 to discuss challenges across electronics manufacturing, from circuit board protection and precision assembly to power electronics and semiconductor applications.
As electronic systems become smaller, denser, and more power-intensive, materials are playing an increasingly important role in maintaining reliability throughout a product’s operating life. MacDermid Alpha is bringing together technologies across several stages of electronics manufacturing to address these evolving requirements.
One of the key technologies on display will be Electrolube® UVFlex, a recently introduced UV-curable conformal coating designed to combine fast processing with durable protection.
UVFlex cures rapidly under UV light, while its secondary moisture-cure mechanism protects areas that may not receive direct UV exposure during processing. Its flexible chemistry is designed to withstand demanding thermal and environmental conditions. The formulation is also PFAS-free and contains 25 to 30% bio-based content, supporting changing material requirements in electronics manufacturing.
MacDermid Alpha will also highlight solutions designed for fine-feature assembly, material efficiency, and power electronics applications.
For advanced soldering applications, the portfolio includes ALPHA® OM-377 solder paste, developed for ultra-fine-feature printing, along with ALPHA OM-100 SnCX® 07 silver-free solder paste, which offers enhanced resistance to mechanical strain. The company will also feature ALPHA EF-6038HF no-clean flux, designed to deliver ultra-low residue and strong hole-filling performance.
In power electronics, Argomax® silver sintering materials and the ATROX® die attach portfolio are designed to support thermal, electrical, and packaging reliability. MacDermid Alpha will also showcase its Micromax™ portfolio, including LTCC materials for telecom and defense applications, materials for passive components, and Green Tape™ materials for reliable probe card applications.
Together, the technologies reflect MacDermid Alpha’s focus on bringing materials and process expertise together across circuit board protection, precision assembly, thermal management, and interconnect reliability.
The company’s experts will be available throughout Productronica India 2026 at Booth H4.G35, giving visitors an opportunity to discuss specific application challenges, material selection, and emerging requirements in electronics manufacturing.
With electronic systems continuing to push the boundaries of density, power, and performance, MacDermid Alpha’s presence at the event will highlight how advanced materials can help manufacturers build more reliable and efficient next-generation electronics.
Meet the company’s experts at Productronica India 2026 and discover the materials and process technologies designed to address the demands of modern electronics manufacturing.
Leadership Comment
“The demands on electronic assemblies continue to increase, both in production and in the environments where they ultimately operate,” said Padmanabha Shakthivelu, Director of Product Management, MacDermid Alpha Electronics Solutions. “UVFlex was developed to respond to both, combining efficient UV processing with the thermal and electrical performance needed for long-term reliability. That combination is especially relevant as manufacturers look to improve process efficiency while designing for more demanding applications.”
