With silver prices becoming more volatile and sustainability requirements accelerating across semiconductor assembly, MacDermid Alpha Electronics Solutions is introducing ATROX CD 560-1, a new die attach paste that offers a zero PFAS alternative silver filler for metal leadframe packages.
As silver prices continue to swing sharply, semiconductor manufacturers are facing growing pressure on assembly budgets and long-term planning.
ATROX CD 560-1 tackles this challenge through an engineered alternate silver filler approach that supports more stable cost management while still delivering reliable performance and production efficiency.
The paste is designed for high-speed, high-volume manufacturing, delivering 2.5 watts per meter-kelvin bulk thermal conductivity and strong die attach performance across key metal leadframe surfaces.
This includes pre-plated frames (PPF), commonly nickel-palladium-gold (NiPdAu), and copper leadframes. It offers consistent dispensing performance with repeatable flow and dispense patterns, plus clean deposits that last through long production runs with minimal maintenance.
ATROX CD 560-1 is manufactured without any added per- and polyfluoroalkyl substances (PFAS), helping customers respond to evolving environmental expectations and regulatory scrutiny while maintaining device performance.
The zero PFAS chemistry aligns with broader sustainability goals without slowing production or adding process complexity.
The paste works with time-pressure pump systems used on most die bonders, allowing consistent dispensing over long production runs. Low outgassing helps maintain cleaner oven environments and supports strong package reliability in downstream processes.
Flexible cure options include snap cure for fast production lines and box-oven cure for conventional manufacturing flows, both delivering consistent results.
By enabling faster operation, lower contamination risk, and improved cost stability, ATROX CD 560-1 expands the ATROX portfolio to address sustainability, throughput, and price stability across semiconductor assembly.
The product reflects the company’s continued commitment to environment, health, and safety while maintaining the reliability and build quality required for advanced semiconductor devices.
Evaluate ATROX CD 560-1 on your next leadframe program and request technical data, samples, and a dispensing review from our team.
Leadership Comment
“This approach sets a new benchmark in conductive die attach by combining manufacturing speed with reliability,” said Avin Dhoble, Product Manager, MacDermid Alpha Electronics Solutions. “It’s tuned dispensing and cure profile supports high-throughput processing, enabling faster production without a quality trade-off.”
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