Semiconductors, Tech Policy, SDGs is Major Focus of The Volt Post

Zephyr Project Secures Platinum Commitments From TI and Infineon

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Intel Patents MicroLED Tech for Glass Substrate Chip Packaging

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TI’s Entire Embedded Portfolio Now On Zephyr RTOS

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EPC’s Next-Gen GaN Power Solutions For AI, Robotics, and Space at electronica 2026

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TakeMe2Space Launches Orbital AI Infrastructure with SpaceX Rideshare Mission

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Infineon Launches Major Backend Manufacturing Hub in Bangkok

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DigiKey Unveils Factory Tomorrow Season 6 on Next-Gen Manufacturing

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Broadcom-Toppan JV Opens Singapore Fab to Clear AI Substrate Bottlenecks

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Teledyne FLIR Secures Industry-First UL 2684 Listing for Thermal Fire Detection Cameras

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Renesas Debuts Industry-First Dual-Side Cooled 650V GaN

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TECH POLICY

Intel Patents MicroLED Tech for Glass Substrate Chip Packaging

VOLT TEAM - October 2, 2026 0

Intel has secured a groundbreaking MicroLED patent that integrates MicroLEDs directly into semiconductor packaging. The innovation leverages glass substrates and Through Glass Vias to deliver...

EPC’s Next-Gen GaN Power Solutions For AI, Robotics, and Space at electronica 2026

VOLT TEAM - October 1, 2026 0

Infineon Launches Major Backend Manufacturing Hub in Bangkok

VOLT TEAM - October 1, 2026 0

Broadcom-Toppan JV Opens Singapore Fab to Clear AI Substrate Bottlenecks

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Teledyne FLIR Secures Industry-First UL 2684 Listing for Thermal Fire Detection Cameras

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Kosuke Akiyoshi Tapped to Lead Panasonic Industry Europe as Spatz Retires

VOLT TEAM - September 30, 2026 0

BOS Semiconductors Joins Arm Ecosystem to Scale Custom Silicon for Physical AI

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NX Group with ISM to Overhaul India’s Chip Supply Chain Logistics

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Navitas Lands ALATTIS Contract to Bridge Critical U.S. Supply Gap in 10 kV SiC Tech

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Resonac Targets 4x Die Yield Boost with Ultra-Large Wafer Format

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ELECTRONICS

Intel Patents MicroLED Tech for Glass...

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TI’s Entire Embedded Portfolio Now On...

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EPC’s Next-Gen GaN Power Solutions For...

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Renesas Debuts Industry-First Dual-Side Cooled 650V...

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Pulsiv and Delta-Matrix to Solve Heat...

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T&M

VIAVI Unveils Compact 100G CyberFlood CF50 for Enterprise...

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Pickering Launches Modular 65-217 Matrix to Simplify Complex...

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Know-How R&S FSWX-KM700 Delivers Precision DRFM Jammer Analysis

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R&S Sixth Mobile Test Summit Sets Sights on...

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DoD Grants VIAVI Solutions Critical Level 2 Cybersecurity...

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DISTRIBUTORS

DigiKey Unveils Factory Tomorrow Season 6...

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Powell Electronics Stocks Bernier’s Rugged IP68...

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Anglia Components Wins Eaton’s 2025 UK...

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New Nigel AI at element14 with...

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TME Showcases Global Reach and Personal...

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ELECTRIC VEHICLES

Ten-Nine Taps Chinese Market Major Jiaohang to...

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BMW Taps ROHM Semiconductor for its “Neue...

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EnerVenue Inks First Major Oilfield Battery Deal...

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Accelerate EV charger development with the EasyEVSE...

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Bikitaite Separator Lifts NCM90 Capacity 42% at...

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VOLT ROOMS

Zephyr Project Secures Platinum Commitments From TI and Infineon

TVP BUREAU - October 2, 2026 0

Texas Instruments (TI) and Infineon Technologies are deepening their investments in the open-source embedded landscape, officially upgrading their memberships in the Zephyr Project to...