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Thermo Fisher Launches EMPAD G2 Detector for High-Speed 4D STEM

VOLT TEAM - August 28, 2026

Thermo Fisher Scientific has introduced the Thermo Scientific EMPAD G2 detector, a new electron microscopy detector designed to help researchers capture and analyze materials...

SEMI Taiwan Launches Chip Materials Alliance to Shore Up Local Supply Chains

TVP BUREAU - August 25, 2026

SEMI Taiwan has rolled out a new semiconductor materials alliance designed to strengthen the island’s domestic supply chains and keep pace with the rapid...

Teledyne Advanced Defense, Space Solutions at 2026 Symposium

VOLT TEAM - August 9, 2026

Teledyne will showcase its portfolio of defense, space, and advanced technology solutions at the 2026 Space & Missile Defense Symposium. The company’s exhibit, located at...

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SOFTWARE & SIMULATION

AttoTude Cuts IC Design Cycles by More Than 50% With Keysight EDA

TVP BUREAU - August 28, 2026

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Tema Launches First MLCC & Power Semiconductor ETF

TVP BUREAU - August 28, 2026

ELECTRONICS

Thermo Fisher Launches EMPAD G2 Detector for High-Speed 4D STEM

VOLT TEAM - August 28, 2026

ROBOTICS

Renesas Accelerates Humanoid Robotics With New AI Lab in Beijing

TVP BUREAU - August 28, 2026

T&M

Rohde & Schwarz Launches AI/ML Design Center, Reinforcing its ‘Make in India, for the world’ commitment

VOLT TEAM - August 28, 2026

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OMC’s New Laboratory-Grade Polish Finish for Industrial Fibre Optic Cables

VOLT TEAM - August 27, 2026

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67% of Indian Service Providers See AI as Major Revenue Driver

TVP BUREAU - August 27, 2026

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TASKING, dSPACE MoU to Advance A&D Software in India

TVP BUREAU - August 27, 2026

ELECTRONICS

Littelfuse Circuit Protection, Power Technologies at electronica India 2026

TVP BUREAU - August 27, 2026

ELECTRONICS

Can Xiaomi’s New Chip Strategy Be A Threat To Qualcomm And MediaTek?

TVP BUREAU - August 26, 2026

ELECTRIC VEHICLES

Pickering Interfaces Brings BMS HIL Test Solutions to electronica India 2026

TVP BUREAU - August 26, 2026

ELECTRONICS

Infineon SiC MOSFETs Cut Fox ESS Switching Losses by 70%

VOLT TEAM - August 26, 2026

ELECTRONICS

TI Breaks EV Current-Sensing Trade-Off With First Multiaxial Coreless Hall Sensor

TVP BUREAU - August 26, 2026

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Taiwan Expo USA 2026 Set to Drive New Taiwan-U.S. Tech and Manufacturing

TVP BUREAU - August 26, 2026

AI/ML

Baya Systems Expands into Japan to Accelerate AI Chip Design With WeaveIP Fabric

VOLT TEAM - August 26, 2026

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SEMI Taiwan Launches Chip Materials Alliance to Shore Up Local Supply Chains

TVP BUREAU - August 25, 2026

ELECTRONICS

GaN power transistors: What 700 V and 100 V PowerGaN bring to power-supply design

VOLT TEAM - August 25, 2026

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Critical Manufacturing, UST To Scale MES, AI-driven Mfg Across Southeast Asia

TVP BUREAU - August 25, 2026

ELECTRONICS

KYOCERA AVX Unveils Vibration-Proof Aluminum Capacitors

VOLT TEAM - August 25, 2026

ELECTRONICS

ROHM Debuts 4th-Gen 650V IGBTs with Lower Loss

VOLT TEAM - August 25, 2026

DATA CENTER

Schneider Electric Launches Installed Base Tracking in India

TVP BUREAU - August 25, 2026

AI/ML

ST and NUS Launch HELIX Lab To Focus om Embodied AI, Edge AI Tech

TVP BUREAU - August 25, 2026

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Menlo Micro Names Rich Simoncic as CEO to Drive Next Growth Phase

VOLT TEAM - August 25, 2026

ELECTRONICS

Littelfuse Launches FlatSuppressX TVS Diodes for 12V Vehicles

VOLT TEAM - August 25, 2026

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Infineon Bets Big on AI Power, Acquires Bengaluru’s C2i Semiconductors

VOLT TEAM - August 24, 2026

ELECTRONICS

MIKROE Launches Compact UWB Board for Real-Time Location

VOLT TEAM - August 24, 2026

SECURITY

Teledyne FLIR Unveils Si2a-PD at Electric & Power Indonesia 2026

VOLT TEAM - August 24, 2026

DISTRIBUTORS

Anglia Components Extends Connectivity Portfolio with OptoMedia Fibre Products

TVP BUREAU - August 24, 2026

ELECTRIC VEHICLES

One in 200 Used EVs Shows Serious Battery Cell Imbalance, Analysis Finds

TVP BUREAU - August 24, 2026

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