PACKAGING
izmo Microsystems Develops India-Made 40 GHz RF QFN Package
IZMO Limited’s semiconductor subsidiary, izmo Microsystems, has developed a high-frequency RF QFN Package designed for semiconductor devices operating at frequencies of up to 40...
KYOCERA AVX Pushes RF Miniaturization with New 0201 KGU Series MLCCs
KYOCERA AVX added a new ultraminiature 0201 case size to its KGU Series high-performance, ultra-low-ESR C0G (NP0) RF multilayer ceramic chip capacitors (MLCCs) to...
Rigaku Advanced X-Ray Solutions for Semiconductor Manufacturing at SEMICON Taiwan 2026
The Rigaku Group will showcase its latest X-ray metrology and inspection technologies at SEMICON Taiwan 2026, as semiconductor manufacturers increasingly turn to advanced packaging,...
Thermo Fisher Launches EMPAD G2 Detector for High-Speed 4D STEM
Thermo Fisher Scientific has introduced the Thermo Scientific EMPAD G2 detector, a new electron microscopy detector designed to help researchers capture and analyze materials...
SEMI Taiwan Launches Chip Materials Alliance to Shore Up Local Supply Chains
SEMI Taiwan has rolled out a new semiconductor materials alliance designed to strengthen the island’s domestic supply chains and keep pace with the rapid...
Teledyne Advanced Defense, Space Solutions at 2026 Symposium
Teledyne will showcase its portfolio of defense, space, and advanced technology solutions at the 2026 Space & Missile Defense Symposium.
The company’s exhibit, located at...