ELECTRONICS
HMS Networks to Host Virtual Engineering Day on CAN XL and Automotive Ethernet
HMS Networks is dedicating October 28 to the nuts and bolts of modern automotive networking with its virtual In-vehicle Communication Engineering Day.
Aimed directly at...
Microchip Expands L-Series with 50-krad Rad-Tolerant, Ultra-Compact LX-820 Oscillator
Microchip Technology has expanded its L-Series timing lineup with the new LX-820 Radiation-Tolerant Quartz Oscillator, a component engineered specifically for Low Earth Orbit (LEO)...
Matching Signal and Power Connectors to Robotic and Other High-Density Industrial Applications
- Barley Li, Applications Engineering Manager – Technical Content, APAC, DigiKey
Smart factories are becoming increasingly automated through decentralized intelligence and control, utilizing modular robotic...
Renesas Debuts Flagship 600MHz MCUs with Embedded MRAM
Renesas has officially leveled up its MCU lineup with the launch of the RX74M and RX74N. Hitting up to 600 MHz, these new flagship...
Infineon and NVIDIA Bring GaN to the Core of 800V AI Data Centers
Infineon Technologies is deepening its collaboration with NVIDIA to tackle one of the most demanding engineering challenges in modern AI data centers which is...
Add USB C power with USB-C Sink 5 Click board from MIKROE
USB-C Sink 5 Click from MIKROE, the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on...
EPC and ADI Unlock 4kW GaN Power Conversion at 98.8% Efficiency
Efficient Power Conversion (EPC) is teaming up with Analog Devices (ADI) to push high-current power conversion into the multi-kilowatt range, pairing its 100 V...
Murata Unveils the World’s Smallest Thermistor
Murata has officially developed the world’s smallest NTC thermistor, the 008004-inch (0.25mm × 0.125mm) NCU01 series.
By cutting the required mounting area by roughly 60%...
Littelfuse TVS Arrays Shield Sub-1V High-Speed Interfaces
Littelfuse has just rolled out two new Bidirectional TVS Diode Arrays, the AQ4315-01ETG and SP4315-01WTG designed to end the traditional compromise between low clamping...
Kia India Launches Mumbai Training Hub to Upskill Next-Gen Auto Workforce
Kia India and the Automotive Skills Development Council (ASDC) have teamed up to build a more industry-ready workforce, officially opening a new automotive skill...
Teledyne FLIR Brings AI-Powered Emissions Detection to CEM Asia 2026
Teledyne FLIR is heading to Kuala Lumpur for CEM and AQUAMATE Asia 2026, running November 17-19 at the KLCC. Stationed at Booth 45, the...
