H.E. Ashish Kumar Sinha, the Indian Ambassador to Estonia, recently toured Brandner Electronics OÜ’s printed circuit board (PCB) manufacturing facility in Paide.
Polymatech-Backed Brandner Electronics Outlines Major Semiconductor and EV Expansion During Indian Ambassador’s Visit.
India’s deepening tech footprint in Europe took center stage as H.E. Ashish Kumar Sinha, the Indian Ambassador to Estonia, recently toured Brandner Electronics OÜ’s printed circuit board (PCB) manufacturing facility in Paide.
Arranged by the Commerce Wing of the Indian Embassy in Tallinn, the visit served as a platform for Brandner to unveil a sweeping, phased development plan that bridges European manufacturing with Indian market demand spanning everything from consumer electronics to next-generation electric vehicle (EV) tech.
Scaling Up Production and Targeting the EV Market
Brandner has already kicked off PCB production for parent company Polymatech’s vein finders and is actively developing boards for upcoming NANORAA smartphones. Once prototypes clear validation, the Paide plant will immediately scale up its capacity and process capabilities for high-volume manufacturing.
But the company is looking far beyond standard and high-density interconnect PCBs. During the tour, executives outlined a near-term roadmap that includes adding surface-mount technology (SMT) module assembly.
More notably, Brandner is laying the groundwork for silicon carbide (SiC) semiconductor packaging and power modules designed specifically for EV applications, with a target launch in 2027. In the longer term, the group is also evaluating sapphire crystal growth and processing at the Paide site.
Bridging Estonia’s Engineering with India’s Market
The Ambassador was welcomed by Polymatech Group Chairman Dr. Eswara Rao Nandam and Brandner Managing Board Member Vishaal Nandam. The technical walkthrough of the facility’s multilayer and aluminum PCB operations was led by Brandner CEO Tarja Rapala-Virtanen, Managing Director Urmas Aruoja, and the core production team.
Polymatech’s investment in Brandner—channeled through its Singapore arm, AEIM Pte. Ltd.—has successfully preserved an advanced European manufacturing hub while building a launchpad for broader expansion in Estonia.
As the visit wrapped up, discussions naturally turned toward strengthening the commercial and industrial pipeline between the two nations. Moving forward, Brandner’s strategy is clear: fuse Estonia’s renowned engineering and manufacturing precision with Polymatech’s global product platforms and massive reach within the Indian tech ecosystem.
Leadership Comments
Commenting on the visit, Dr Eswara Rao Nandam, Group Chairman, Polymatech, said, “We are deeply honoured by His Excellency’s visit to our Paide facility. Estonia offers a skilled workforce, a transparent business environment and a strong foundation for advanced manufacturing. The visit has encouraged our entire team as we build the next phase of Brandner in Estonia.”
Speaking on the occasion, H.E. Mr Ashish Kumar Sinha, Ambassador of India to the Republic of Estonia, said, “It was enriching to visit the Brandner Electronics facility in Paide; a strategic manufacturing base marks an important milestone in growing bilateral commercial ties between India and Estonia, looking forward to its exponential growth in near future.”
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