DATA CENTER
Design Power Converters with GaN Technology to Meet the Demands of AI Datacenters
– Barley Li, Applications Engineering Manager – Technical Content, APAC, DigiKey
The demand for artificial intelligence (AI) has rapidly increased datacenter energy requirements. To support...
Qualcomm and Amazon Expand Collaboration on AI Data Center Silicon
Qualcomm and Amazon are expanding their collaboration to develop customized silicon for large-scale AI data centers, with the companies entering a multi-generation partnership focused...
Messe München India, dmg Launch AiX DataWorld 2027 in India
As India’s data-centre market races to keep up with AI, cloud and digital-services demand, Messe München India and dmg events have announced AiX DataWorld...
LITEON Takes 25% Stake in DCX Liquid Cooling for $176M
Taiwan’s LITEON Technology has made a strategic investment in Warsaw-based DCX POLSKA Sp. z o.o. (“DCX Liquid Cooling Systems”), securing roughly a 25% equity...
Tema Launches First MLCC & Power Semiconductor ETF
Tema ETFs has launched the Tema MLCC & PowerSemi ETF (PSOX), positioning the fund as the first ETF focused specifically on the global multi-layer...
GaN power transistors: What 700 V and 100 V PowerGaN bring to power-supply design
Power designs now face the same demands at the same time: higher efficiency, smaller size, lower cost, and more power from the same space....
Schneider Electric Launches Installed Base Tracking in India
Schneider Electric has launched its Installed Base Tracking campaign in India, aimed at helping businesses create a digital identity for their critical electrical assets...
A Smarter Approach to Data Center Reliability
For data center operators, risk rarely starts and ends with one system or department. It could begin with a cut fence, an intruder moving...
Sivers, SemiNex to Power AI Data Center Interconnects
Sivers Semiconductors and SemiNex Corporation announced a program for next-generation InP light sources for AI data center interconnects.
The program is initially valued at approximately...
Industry-First: Power Integrations Pushes PowiGaN to 2200 V
Power Integrations has pushed its PowiGaN gallium-nitride (GaN) platform to a new level; the company has now rolled out devices rated up to 2200...
Montage’s MXC Trial Pushes Closer to Composable, Memory-Centric Architectures
Montage Technology has entered trial production of its CXL 3.2 MXC Chip, positioning it as a solution to growing memory bottlenecks in AI, cloud,...