ELECTRONICS
TI’s Entire Embedded Portfolio Now On Zephyr RTOS
Texas Instruments is officially throwing its weight behind the Zephyr Project. The semiconductor giant announced that its entire embedded portfolio, spanning microcontrollers, microprocessors, and...
EPC’s Next-Gen GaN Power Solutions For AI, Robotics, and Space at electronica 2026
As artificial intelligence pushes data center power requirements to their limits, Efficient Power Conversion (EPC) is bringing its latest gallium nitride (GaN) solutions to...
Renesas Debuts Industry-First Dual-Side Cooled 650V GaN
Renesas Tackles AI Data Center Heat with Industry-First Dual-Side Cooled 650V GaN Device.
As AI data centers push rack power limits from 120 kW toward...
Pulsiv and Delta-Matrix to Solve Heat Crisis in High-Power, In-Wall USB-C Charging
Pulsiv has struck an exclusive manufacturing deal with Delta-Matrix to mass-produce its next-generation USB-C power modules. The partnership takes aim at a rapidly growing,...
MaxLinear Debuts Puma 9 SoC to Enable Software-Upgradable DOCSIS 4.0
For broadband operators, the transition to DOCSIS 4.0 has long felt like a financial trap delivering next-generation, multi-gigabit speeds usually means ripping out and...
Powell Electronics Stocks Bernier’s Rugged IP68 CMA Connectors
Powell Electronics is now stocking Bernier’s CMA series of stainless-steel circular connectors, delivering a highly ruggedized connectivity solution for defense, aerospace, and heavy industrial...
Wolfspeed Launches Ultra-Low-Defect 200mm SiC Substrates to Boost Yields
As the semiconductor industry pushes the limits of silicon carbide (SiC) for high-voltage applications, the margin for manufacturing error is rapidly shrinking. To help...
OK3588-C + 4x RK1828 PCIe Cascade: Delivering 40W Edge-Side 27B/31B LLM Local Inference
In edge computing and industrial IoT scenarios, deploying large language models at the field site is becoming a clear trend. Compared to cloud inference,...
ST Packs Premium Infrared Vision into a Tiny, Cost-Cutting Automotive Sensor
As automakers rush to make driver and occupant monitoring a standard feature across their lineups, they face a familiar bottleneck - balancing high-end camera...
Microchip Unveils Proactive 65V Power Monitors For Next-Gen 48V Architectures
The PAC1761 and PAC1861 families are designed to help customers build better performing and more reliable 48V systems that can measure instantaneous conditions and...
Renesas Unveils the Microscopic SLG46801 GreenPAK for Next-Gen Wearables
As wearables like smart rings, fitness bands, and VR glasses pack in more features, finding room on the circuit board is becoming a major...
