Tessolve has partnered with Intel Foundry to support advanced package design like EMIB chiplet packaging. Embedded Multi-die Interconnect Bridge (EMIB) has become a key technology...
Catena-X Automotive Network e.V., in partnership with the China Association of Automobile Manufacturers (CAAM) and VDA China, has launched what it describes as the...
Silvaco Group and NVIDIA to push digital twins for semiconductor design and manufacturing to the next level. The companies announced a collaboration that combines...
Artificial Intelligence (AI) is becoming a transformative force shaping our everyday lives. From wearable devices that monitor our health in real time to autonomous...
Navitas Semiconductor and Magnachip Semiconductor have struck a strategic partnership aimed at speeding up SiC adoption in high-voltage and ultra-high-voltage power markets.
Under the agreement,...
Palomino Laboratories has shipped its first-generation MicroLED light engine prototypes to its first hyperscaler customer, marking an early milestone for the company’s optical interconnect...
BYD has chosen DTS AutoStage™ as its exclusive in-car media platform, bringing a more connected audio and video experience to future vehicles for BYD...
Sitting in STMicroelectronics’ recent IMG media briefing, one theme came through immediately that the company no longer sees its imaging devices as simple cameras,...
Littelfuse has introduced the TP5.0SMD-FL and TP1KSMB-FL Series FlatSuppressX™ TVS Diodes, expanding its portfolio of transient voltage suppression devices for 48 V automotive electronics....