Tessolve has partnered with Intel Foundry to support advanced package design like EMIB chiplet packaging. Embedded Multi-die Interconnect Bridge (EMIB) has become a key technology enabling next-generation heterogeneous chiplet architectures.
As part of the collaboration, Tessolve is now positioned to support Intel Foundry customers globally. The company has already completed an end-to-end project covering package design and simulation, gaining hands-on experience with EMIB while accelerating its qualification process for the technology.
Developed by Intel, EMIB enables high-density die-to-die connectivity, supporting low-pitch bump integration with High Bandwidth Memory (HBM) and compatibility with the Universal Chiplet Interconnect Express (UCIe) standard.
As chiplet-based designs become central to advanced semiconductor development, open standards like UCIe are playing a critical role in defining interconnect protocols and improving interoperability.
The collaboration is aimed at reducing development costs, minimizing design risks, and speeding up innovation cycles for next-generation semiconductor applications.
Tessolve, an engineering services provider operating in the $550 billion semiconductor market, has been expanding its global capabilities to support such advanced technologies. The company has established 11 semiconductor test and embedded labs worldwide to deliver end-to-end solutions to its customers.
In September 2025, the company secured $150 million in funding from TPG to strengthen its global delivery infrastructure, expand advanced testing facilities, and pursue strategic acquisitions as it looks to deepen its role in both the global and Indian semiconductor ecosystems.
Leadership Comments
“Over the past two decades, Tessolve has grown into a trusted engineering partner for many of the world’s leading semiconductor companies.”, said Srini Chinamilli, Co-Founder & CEO, Tessolve. “Intel Foundry’s EMIB, combined with our end-to-end capabilities across the semiconductor value chain, allows us to further expand our offerings for Intel Foundry customers.”
“Tessolve has already built deep capabilities over the past two decades, from chip architecture, design, test development and embedded systems”, said Vic Vadi, VP – Ecosystem, Foundry Services, Intel Corporation. “With this collaboration for enablement on our EMIB, we aim to combine Tessolve’s expertise with our advanced package design and test technology to provide our customers with end-to-end solutions to swiftly navigate the complexities of modern electronics design.”
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