Infineon Technologies and MediaTek are teaming up to power more advanced, AI-driven experiences inside next-generation vehicles. As part of the collaboration, MediaTek has qualified Infineon’s 512 Mb QSPI NOR Flash for its Dimensity Auto Cockpit platform C-X1, making the chip an approved, drop-in memory option for automakers, Tier?1 suppliers, and design partners building smarter in?cabin systems.
What The Chip Does In The Cockpit
The 512 Mb QSPI NOR Flash stores the firmware and boot code that enable AI features at the system-on-chip level, from voice assistants and driver monitoring to travel vlog generation, environmental perception, and personalized audio-visual recommendations.
It also supports Safe and Secure Boot, adding a layer of redundancy that strengthens overall system safety.
Easier Choice for OEMs and Suppliers
By landing on MediaTek’s approved list, Infineon’s device becomes an easier choice for automotive customers integrating the C-X1 cockpit platform, reducing qualification friction and speeding time to market for new smart-cockpit designs.
Under the hood – MirrorBit and Automotive Hardening
Infineon’s NOR Flash is built on its MirrorBit technology, which delivers a robust interface and broad compatibility with leading automotive SoCs.
The part carries AEC?Q100 qualification and is rated for operation up to +125 °C, meeting the thermal and reliability demands of in?vehicle environments.
Leadership Comments
“Automotive memory is a strategic enabler of innovation as software-defined vehicles 
depend on high-performance Systems-on-Chip (SoCs), increasingly complex firmware, and large data stores,” said Rainer Hoehler, Senior Vice President Memory Solutions at Infineon Technologies. “Cutting-edge digital cockpits and over-the-air update capabilities are driving the demand for higher density NOR flash. With the qualification by MediaTek, customers can now easily integrate Infineon’s 512 Mb NOR Flash as a future?ready memory solution for smart cockpits.”
“Infineon’s automotive-grade NOR Flash delivers the performance, reliability, and functional safety features required for our premium and high-end Dimensity Auto Cockpit platform C-X1,” said Mike Chang, MediaTek Vice President and Auto Business General Manager. “Its high-density design enables the advanced AI and user-experience capabilities that will be essential in next-generation software-defined vehicles. Building on our long-standing collaboration, we leverage Infineon’s industry leadership to deliver a reliable backbone for the evolving software-defined ecosystem.”
To Know More About Availability, CLICK HERE
