FLAG is supercharging one of the few direct digital routes between Singapore and the United States, bringing ultra-high-speed connectivity to a crucial trans-Pacific corridor.
The company is upgrading its dedicated fiber pair on the 16,000-kilometer ECHO subsea cable system by deploying Ciena’s Waveserver platform. To maximize the cable’s overall performance, the rollout integrates Ciena’s RLS line system alongside cutting-edge WaveLogic 6 Extreme (WL6e) 1.6 Tb/s coherent optics.
Spanning Singapore, Guam, and California, the ECHO route adds a highly resilient new trans-Pacific link to the company’s “Fiber Links Around the Globe” (FLAG) portfolio, giving vital digital hubs across Asia and North America a massive bandwidth boost.
This latest upgrade also perfectly complements FLAG’s existing WL6e-powered India Asia Express network.
Together, the systems create a fully integrated, high-performance digital pipeline that seamlessly links major data centers and economic hubs across India, South Asia, Southeast Asia, and North America.
Leadership Comments
“Our investment in ECHO enables us to transport rapidly growing volumes of AI, cloud, and enterprise traffic across one of the world’s most important digital corridors,” said Brad Kneller, Chief Network Officer, FLAG. “Using Ciena’s leading coherent optical technology, we can rapidly bring new 400GbE and 800GbE services to market while 
delivering the scale, resiliency, and performance our customers require as AI and cloud traffic continue to accelerate.”
“High-capacity subsea routes such as ECHO are essential to supporting the surging digital traffic moving between Asia and North America,” said Amit Malik, Vice President, Asia Pacific, Japan, and India, Ciena. “WL6e enables FLAG to extract greater value from its ECHO fiber pair by optimizing capacity, improving network density and efficiency, and accelerating the introduction of new services.”
Ciena (Booth #H03) and FLAG (Booth #G04) are at the upcoming Submarine Networks World event in Singapore, with Ciena speaking on a keynote and a panel discussion on September 23, 2026.
