Tessolve has partnered with Intel Foundry to support advanced package design like EMIB chiplet packaging. Embedded Multi-die Interconnect Bridge (EMIB) has become a key technology...
Navitas Semiconductor and Magnachip Semiconductor have struck a strategic partnership aimed at speeding up SiC adoption in high-voltage and ultra-high-voltage power markets.
Under the agreement,...
Palomino Laboratories has shipped its first-generation MicroLED light engine prototypes to its first hyperscaler customer, marking an early milestone for the company’s optical interconnect...
Littelfuse has introduced the TP5.0SMD-FL and TP1KSMB-FL Series FlatSuppressX™ TVS Diodes, expanding its portfolio of transient voltage suppression devices for 48 V automotive electronics....
ROHM has introduced a new evaluation board, the BD83070GWL-EVK-002, built to showcase the full capabilities of its BD83070GWL buck-boost DC-DC converter IC. The device...
Infineon Technologies has introduced the RIC70115, a rad-hard GaN HEMT driver built for satellites and other high-reliability space systems where power conversion performance and...
CuspAI launches the AI Materials Foundry, a networked infrastructure that ties together data, labs, compute and scientific expertise under a single agentic platform. The...
By Abhishek Jadhav
Industrial electromechanical systems are becoming more compact and software defined. The functions that were previously handled by mechanical contacts, optical isolation, thermal...
As industrial systems grow more connected and automated, Power over Ethernet (PoE) is becoming a critical enabler delivering both power and data over a...
SILITH Technology and United Microelectronics Corporation (UMC) have reached a key milestone in silicon photonics manufacturing, announcing the first mass-production wafer delivery of silicon...
ABB acquires Advantics also enhances ABB’s ability to design and deploy advanced DC systems with greater power density, resilience, and flexibility.
ABB is strengthening its...