Indium Corporation will showcase its portfolio of high-performance solder pastes, low-silver solder alloys, and thermal interface materials at Productronica India, taking place September 16-18 in Bengaluru, India.
With a team of manufacturing and technical experts supporting customers across India, the company will highlight several solutions designed to address challenges in reliability, miniaturization, thermal management, and demanding electronics manufacturing processes.
Among the products on display will be Indium Corporation’s Durafuse® Technology, a patented solder paste alloy system developed to improve solder joint quality and reliability in complex electronic designs. The technology enables high reliability at lower processing temperatures, helping manufacturers reduce their carbon footprint while improving process yields.
The company will also feature two Durafuse alloy solutions:
- Durafuse® LT is a low-temperature alloy designed for large BGA assemblies that can be affected by temperature-induced warpage, uneven PCB heating during reflow, or temperature-sensitive components. By lowering peak reflow temperatures, the alloy helps address these challenges while delivering strong thermal cycling and drop-shock performance.
- Durafuse® HR is designed for high-reliability applications, including automotive and mobile infrastructure. It offers enhanced thermal cycling performance across temperatures ranging from -40°C to 125°C and -40°C to 150°C, along with improved voiding control.
For fine-feature electronics manufacturing, Indium Corporation will highlight Indium12.9HF, a no-clean, halogen-free solder paste formulated for applications involving very small components, including 01005 and 008004 packages.
The solder paste is engineered to deliver high stencil print-transfer efficiency across a broad range of processes, helping manufacturers improve solder paste inspection (SPI) yields. It also provides low voiding across BGA, CSP, LGA, and QFN packages, while offering high oxidation resistance without graping or solder balling on pads as small as 175 microns during air reflow.
Another solution on display will be Indium10.1HF, an air-reflow, no-clean, halogen-free and lead-free solder paste developed for applications requiring ultra-low voiding, particularly designs with large ground pads. Its flux chemistry is designed to support reliability by reducing voiding while improving ECM and Head-in-Pillow (HIP) performance. The material also provides strong wetting characteristics along with controlled solder beading, solder balling, and slump.
Indium Corporation will also showcase Indium10.8HF, an air-reflow, no-clean solder paste formulated for the higher processing temperatures associated with SnAgCu, SnAg, and other alloy systems increasingly used as alternatives to conventional lead-bearing solders.
Through its presence at Productronica India, Indium Corporation will give electronics manufacturers an opportunity to explore soldering and thermal management solutions aimed at improving process performance, reliability, and manufacturing efficiency.
To learn more about Indium Corporation’s high-reliability thermal management and low-silver alloy solutions, visit indium.com or meet the company experts at Productronica India 2026, Booth H4.B81.
