POWER ELECTRONICS
Toshiba Ramps Up Compact Cortex-M4 MCUs for Single-Motor Control
Toshiba Electronic Devices & Storage Corporation has begun mass production of its TXZ+ Family Entry-Class M4L Group, a new series of compact motor-control microcontrollers...
New Guide on Precision Wafer Processing with Diamond Technology
Hyperion Materials & Technologies has introduced a new practical guide, Diamond Solutions for Semiconductors, aimed at helping chipmakers navigate the growing complexities of advanced...
Enphase Energy Publishes White Paper on Kestrel ASIC
Enphase Energy has released a new technical white paper detailing its latest custom silicon platform, the “Enphase Kestrel ASIC,” a purpose-built chip designed to...
Tessolve Ties Up with Intel Foundry for Advanced EMIB Packaging
Tessolve has partnered with Intel Foundry to support advanced package design like EMIB chiplet packaging. Embedded Multi-die Interconnect Bridge (EMIB) has become a key technology...
Magnachip Moves into HV SiC with Navitas
Navitas Semiconductor and Magnachip Semiconductor have struck a strategic partnership aimed at speeding up SiC adoption in high-voltage and ultra-high-voltage power markets.
Under the agreement,...
Palomino Sends First MicroLED Prototypes to Hyperscaler
Palomino Laboratories has shipped its first-generation MicroLED light engine prototypes to its first hyperscaler customer, marking an early milestone for the company’s optical interconnect...
Littelfuse Unveils FlatSuppressX TVS Diodes Targeting 48V Auto Systems
Littelfuse has introduced the TP5.0SMD-FL and TP1KSMB-FL Series FlatSuppressX™ TVS Diodes, expanding its portfolio of transient voltage suppression devices for 48 V automotive electronics....
ROHM Unveils Ultra-Compact BD83070GWL-EVK-002 Buck-Boost Power Board
ROHM has introduced a new evaluation board, the BD83070GWL-EVK-002, built to showcase the full capabilities of its BD83070GWL buck-boost DC-DC converter IC. The device...
Infineon Brings Rad-Hard GaN to Space Power
Infineon Technologies has introduced the RIC70115, a rad-hard GaN HEMT driver built for satellites and other high-reliability space systems where power conversion performance and...
CuspAI’s AI Materials Foundry Targets The Materials Bottleneck
CuspAI launches the AI Materials Foundry, a networked infrastructure that ties together data, labs, compute and scientific expertise under a single agentic platform. The...
Building Smarter Electromechanical Systems with Control, Isolation, and Protection
By Abhishek Jadhav
Industrial electromechanical systems are becoming more compact and software defined. The functions that were previously handled by mechanical contacts, optical isolation, thermal...