VIAVI Solutions will showcase its end-to-end portfolio of test solutions for foundational silicon technologies, optical modules and data center systems at booth 1001 during ECOC 2026, taking place from September 21-23 at the FYCMA exhibition center in Malaga, Spain.
The company will highlight technologies designed to address test requirements across the full lifecycle, from design validation and manufacturing to deployment and ongoing network monitoring, as AI infrastructure continues to drive higher network speeds, greater fiber density and increasingly complex optical architectures.
Hyperscalers and cloud providers are rapidly expanding AI infrastructure, pushing network capacity toward 1.6T deployments across scale-up, scale-out and scale-across architectures, while planning for 3.2T is already underway. These next-generation networks are built around 16x224G and 8x448G lane architectures, supported by technologies including Silicon Photonics (SiPh), Co-packaged Optics (CPO) and high-density optical connectivity.
The shift is also accelerating the growth of fiber interconnects and multifiber connectivity. At the same time, emerging quantum technologies are changing security assumptions and adding further complexity to system-level testing.
Advanced 1.6T AI fabric validation
At ECOC 2026, VIAVI will demonstrate its latest technologies for L0 to L3 High-Speed Ethernet (HSE) testing, including the ONE LabPro ONE-1600, described as the industry’s first fully integrated test solution for pluggable 1.6T transceivers.
The platform now supports a new flexible configuration that combines both IHS and RHS interfaces within the same module. VIAVI will also display the new ONE-1600 ERP 1.6T module, developed for network equipment manufacturers and production environments. The module is sized for these applications and offers a core feature set at a lower price point.
Also on display will be TestCenter D2, which enables comprehensive Layer 2 and Layer 3 testing of AI workloads at 1.6T. The platform is designed to identify interconnect bottlenecks, latency hotspots and fault-tolerance gaps that can limit GPU utilization and constrain AI cluster scalability.
VIAVI said TestCenter D2 is the industry’s first Ultra Ethernet Transport (UET) validation solution for AI fabric validation across the Ultra Ethernet ecosystem.
New manufacturing test capabilities for CPO and SiPh
For manufacturing environments, VIAVI will showcase new additions to its MAP-300 platform, targeting the growing requirements for CPO and SiPh testing.
Designed for high-density applications driven by optical connectivity, silicon test insertions and subsystem manufacturing, the platform will feature a Remote Head Polarity Mapper, High-Density Variable Optical Attenuator (HD VOA), High-Density Optical Power Meter (HD OPM) and High-Density In-Line Optical Power Meter (HD IL-OPM).
The MAP-300 also supports quantum key distribution (QKD) and hybrid network evaluation.
VIAVI will additionally present its optical connector end-face geometry test solutions from the acquired Direct Optical Research Company (DORC) product line for the first time. These fiber surface topology measurement products expand the company’s portfolio of interferometry, inspection and cleaning technologies for connectivity manufacturers.
Testing from deployment to ongoing monitoring
For deployment and monitoring applications, VIAVI will introduce the MAP-2800 test head for both standalone operation and centralized testing with the Fusion test system.
The company describes the MAP-2800 as the industry’s first rack-mounted Ethernet tester for centralized and field testing from 10M to 800G.
It can work alongside other VIAVI handheld testers, test heads, virtual agents and smart Small Form-factor Pluggables (SFPs) used at lower-bandwidth sites. The approach is designed to automate testing processes and help reduce the need for truck rolls.
VIAVI will also demonstrate the DCX-700Â test set, designed for automated tier-1 certification and validation of high fiber-count networks. The system is intended to help data center operators deploy large-scale MPO/MMC-based connectivity more quickly and with greater confidence.
Rounding out the showcase will be VIAVI’s expanding portfolio for Hollow Core Fiber (HCF) testing. The company’s T-BERD/MTS-4000 and OneAdvisor800 support advanced characterization, qualification and monitoring of HCF infrastructure as the industry explores new approaches to reducing latency and improving optical network performance.
With AI infrastructure placing new demands on network bandwidth, optical density and system reliability, VIAVI is positioning its ECOC 2026 showcase around the growing need for comprehensive testing across silicon, optics and network infrastructure.
