Qualcomm and Amazon are expanding their collaboration to develop customized silicon for large-scale AI data centers, with the companies entering a multi-generation partnership focused initially on AI inference.
The collaboration of Qualcomm and Amazon comes as rapidly growing AI workloads continue to push demand for compute, storage, networking and memory bandwidth, while data center operators face increasing pressure to improve energy efficiency.
By combining Amazon’s secure, comprehensive and price-performant AI infrastructure with Qualcomm Technologies’ expertise in power-efficient processing, silicon design and system-level integration, the companies aim to address these challenges at scale.
Beyond customized silicon, Qualcomm Technologies and Amazon are also working on high-performance optical connectivity solutions designed to keep pace with the bandwidth requirements of next-generation AI infrastructure. The companies plan to develop solutions supporting connectivity speeds of up to 1.6T, along with future generations of optical technologies.
The work will draw on Qualcomm Technologies’ advanced SerDes and optical DSP technologies, which are designed to support high-speed data movement across increasingly demanding AI systems.
As part of the expanded relationship, Qualcomm Technologies also plans to increase its use of AWS AI infrastructure for electronic design automation (EDA) workloads. This includes Amazon Bedrock, with the goal of accelerating chip development and reducing overall design cycle times.
Together, the initiatives reflect a broader push to build AI infrastructure that can scale with growing workloads while improving performance, power efficiency and the speed of silicon development.
Leadership Comments
“As AI demand accelerates, data center infrastructure will require advances in both computing and connectivity to deliver greater performance with more efficiency,” said Cristiano Amon, President and CEO, Qualcomm Incorporated. “Qualcomm is pleased to work with AWS on customized silicon and connectivity solutions, bringing decades of leadership in advanced processing and power-efficient compute, to deliver breakthrough performance and enable the next generation of AI infrastructure.”
“This collaboration with Qualcomm Technologies builds on a strong foundation of partnership and reflects our shared commitment to pushing the boundaries of what’s possible,” said Prasad Kalyanaraman, Vice President, AWS. “By working together on customized silicon and advanced connectivity, we’re delivering more performant, efficient, and cost-effective infrastructure for our customers.”
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