The companies said the partnership will focus on developing glass substrate semiconductor packaging that can deliver higher performance, denser interconnects and better power efficiency for next-generation computing platforms.
Intel Corporation and Lens Technology have struck a strategic collaboration to push forward advanced semiconductor packaging, with glass substrate technology at the center of the effort.
The companies said the partnership will focus on developing glass substrate semiconductor packaging that can deliver higher performance, denser interconnects and better power efficiency for next-generation computing platforms.
Intel and Lens Technology will bring together their strengths in advanced packaging, precision manufacturing, glass substrate R&D and process innovation as demand rises across AI, data centers and specialized computing.
The two companies will also explore opportunities to scale critical manufacturing processes and widen adoption of advanced packaging technologies.
In addition, Intel Corporation and Lens Technology see potential to work together on AI PC components, thermal and structural solutions for data center servers, and hardware for AI robotics, intelligent industrial equipment and edge computing.
Leadership Comment
“Advanced packaging is becoming a critical driver of semiconductor innovation as AI systems continue to push the boundaries of performance, scale, and efficiency,” said Lip-Bu Tan, CEO of Intel. “Intel brings deep expertise in semiconductor architecture and advanced packaging technologies, while Lens Technology contributes world-class capabilities in precision glass processing, laser manufacturing, and large-scale production. Together, we have an opportunity to explore new 
approaches to advanced packaging that can help unlock the next generation of system-level innovation for the AI era.”
?“Lens Technology has built its leadership on advanced materials engineering and precision manufacturing, serving some of the world’s most demanding technology companies,” said June Chau, founder and chairwoman of Lens Technology. “By combining Lens Technology’s expertise in glass materials, high-precision laser processing, and advanced manufacturing with Intel’s leadership in semiconductor design and packaging, we believe we can help accelerate innovation in advanced packaging technologies. This collaboration will support the rapid development of next-generation computing solutions and AI infrastructure for customers around the world.”
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