ELECTRONICS
Openchip Unveils Europe’s First Sovereign RISC-V Chip on Sub-2nm Process
Openchip has rolled out BER10, a fully functional, Linux-capable 64-bit processor built on a leading-edge sub-2nm Gate-All-Around (GAA) manufacturing process. Designed and developed in...
Renesas Pushes DDR5 MRDIMM to 16,000 MT/s for AI Data Centers
Renesas Electronics Corporation is rolling out its (Gen 3) DDR5 MRDIMM chipset solutions, pushing server-class memory speeds to 16,000 MT/s. The move comes as...
NeoCortec Rolls Out White Paper on NeoMesh Over LoRa® for Massive IoT
NeoCortec has published a new white paper detailing how its NeoMesh protocol operates over LoRa® modulation as the physical layer and what that combination...
Skylark GNSS Comes to MIKROE’s GNSS 19 Click
Through a new partnership with Swift Navigation, a precise positioning technology major, MIKROE is bringing Swift’s Skylark® Precise Positioning Service to its GNSS 19...
Toshiba Ramps Up Compact Cortex-M4 MCUs for Single-Motor Control
Toshiba Electronic Devices & Storage Corporation has begun mass production of its TXZ+ Family Entry-Class M4L Group, a new series of compact motor-control microcontrollers...
Eliyan Hits $1B Valuation with $145M AI Interconnect Bet
Eliyan Corporation has raised $145 million in an oversubscribed Series C funding round, reaching a $1 billion valuation as it looks to scale its...
New Guide on Precision Wafer Processing with Diamond Technology
Hyperion Materials & Technologies has introduced a new practical guide, Diamond Solutions for Semiconductors, aimed at helping chipmakers navigate the growing complexities of advanced...
Enphase Energy Publishes White Paper on Kestrel ASIC
Enphase Energy has released a new technical white paper detailing its latest custom silicon platform, the “Enphase Kestrel ASIC,” a purpose-built chip designed to...
Danisense Launches DP12IP High-Precision Current Transducer
Danisense has introduced a new high-precision current transducer, the DP12IP, aimed at enabling accurate isolated DC and AC current measurement in demanding PCB-mounted power...
Kingston with STEIGER DYNAMICS to Power AI-Ready Systems
Kingston Technology Company has announced a partnership with system builder STEIGER DYNAMICS to supply memory for its custom-built systems, which range from high-performance creator...
Tessolve Ties Up with Intel Foundry for Advanced EMIB Packaging
Tessolve has partnered with Intel Foundry to support advanced package design like EMIB chiplet packaging. Embedded Multi-die Interconnect Bridge (EMIB) has become a key technology...