MacDermid Alpha Electronics Solutions will showcase its latest semiconductor assembly materials at SEMICON India 2026, taking place from September 17 to 19 at Yashobhoomi, the India International Convention and Expo Centre (IICC), in Dwarka, New Delhi.
At Booth H6807, visitors can meet MacDermid Alpha’s technical specialists and explore ALPHA® ATROX® CD 560-1, a PFAS-free, silver-alternative conductive die attach paste developed for standard conductive die attach applications .
The product comes as India’s semiconductor manufacturing ecosystem enters a period of rapid expansion under the India Semiconductor Mission, with several new manufacturing facilities being developed or moving through qualification. As local capacity grows, engineering and procurement teams are expected to face greater pressure to qualify materials that combine cost stability, regulatory compliance and reliable package performance.
The growing volatility in silver prices, along with increasing requirements around PFAS, is also encouraging semiconductor manufacturers to evaluate alternatives for conductive die attach applications. However, moving away from silver requires more than simply addressing material cost or regulatory concerns. Die attach materials must also deliver thermal performance, bond strength, process consistency, yield and long-term reliability.
MacDermid Alpha says ATROX CD 560-1 addresses these requirements through a copper-filler approach designed for standard conductive die attach applications in metal leadframe packages. The material contains no intentionally added PFAS and is designed for high-throughput automated dispensing. It also offers adhesion to copper and pre-plated leadframes, low outgassing and MSL-1 performance, with zero delamination reported in qualified package designs.
Testing conducted with a 2 × 2 mm bare silicon die on copper leadframes, following a one-hour cure at 175 °C, recorded die-shear values of 13.5 kg at 25 °C and 3.5 kg at 260 °C. These results provide measurable room-temperature and elevated-temperature benchmarks for engineers comparing conductive die attach materials.
Beyond material performance, process compatibility will be an important part of the evaluation. Engineers can assess dispense behaviour, bondline consistency, void control and adhesion using techniques including X-ray inspection, scanning acoustic microscopy (SAM) and cross-section analysis.
For quality and procurement teams, this process and performance data can also help assess wider considerations such as supply risk, cost exposure and package reliability when evaluating alternative die attach materials.
At SEMICON India, MacDermid Alpha will discuss how its ATROX materials can support standard die attach programmes as well as broader semiconductor assembly requirements. Visitors to Booth H6807 will have an opportunity to review application suitability, qualification considerations and technical data related to PFAS-free silver-alternative die attach evaluations.
The company will also highlight its Micromax™ portfolio, which includes LTCC materials for high-reliability telecommunications and defence applications, passive component materials and GreenTape™ solutions designed to support probe card reliability.
Leadership Comment
“India’s semiconductor ecosystem is scaling rapidly, and customers need materials that support both innovation and manufacturing discipline,” says Senthil Kanagavel, Director of Standard Die Attach at MacDermid Alpha Electronics Solutions. “ATROX CD 560-1 provides engineering and sourcing teams with a structured approach to evaluating a silver-alternative die attach material manufactured with no added PFAS, while keeping reliability, yield and process control at the center of the decision. With regional application engineering support available across Southeast Asia and the Indian subcontinent, we can assist customers throughout the qualification program, from dispense Design of Experiments (DOE) through Approved Vendor List (AVL) entry.”
Discover how ALPHA ATROX CD-560-1 and MacDermid Alpha’s application expertise can support your die attach evaluation and qualification requirements at SEMICON India 2026.
