The Rigaku Group will showcase its latest X-ray metrology and inspection technologies at SEMICON Taiwan 2026, as semiconductor manufacturers increasingly turn to advanced packaging, HBM and complex logic architectures.
The exhibition will take place from September 2 to 4, 2026, at TaiNEX 1 and 2 in Taipei. Taiwan remains one of the world’s key semiconductor manufacturing hubs, with a major role in advanced logic, high-bandwidth memory (HBM) and advanced packaging.
Rigaku’s presence at the event follows the opening of its Rigaku Technology Center Taiwan (RTC-TW) in 2025. At SEMICON Taiwan, the company will demonstrate solutions covering the semiconductor development cycle from R&D to high-volume manufacturing, with a focus on process control, materials characterization and non-destructive analysis.
One of the key highlights will be the XHENA AX-3000, an X-ray inspection system developed for 2.5D and 3D packaging.
Its 3D laminography and automated defect identification capabilities allow manufacturers to inspect hidden structures that can be difficult to evaluate using conventional optical inspection.
The system supports high-resolution, sub-micron detection of defects in micro-bumps and through-silicon vias (TSVs) used in CoWoS, HBM and hybrid bonding. It is currently available for customer evaluation.
Rigaku will also present the XHEMIS WX-PLP310, a new X-ray analyzer for panel-level packaging (PLP) process control. The system measures material composition and thin-film thickness across large substrates, addressing the industry’s move towards larger panel formats. It is also available for customer evaluation.
The company’s XTRAIA MF Series will feature the XTRAIA MF-3400, a fourth-generation multifunctional X-ray metrology platform designed for high-throughput thin-film analysis. The XTRAIA XD-3300 will also be showcased for high-precision measurement of advanced structures on ultra-small wafer pads.
For advanced packaging, HBM, hybrid bonding and BEOL process control, Rigaku will highlight its ONYX Series, which combines X-ray and optical technologies for fast, non-destructive characterization of complex multilayer structures.
Rigaku will also highlight its strategic alliance with Onto Innovation, bringing together X-ray and optical technologies to advance hybrid metrology solutions for semiconductor manufacturing.
Rigaku Group will mark another milestone at the exhibition as it celebrates its 75th anniversary. The booth will feature Dr. Rixsee, an official Rigaku brand mascot created by employees for the anniversary. Visitors can also receive a complimentary Rigaku 75th Anniversary Journal, while supplies last.
CoWoS (Chip-on-Wafer-on-Substrate) is an advanced packaging technology that integrates multiple chips in a single package.
Panel-level packaging (PLP) uses large rectangular substrates instead of round wafers, allowing more chips to be processed in a single production run.
- Dates:Â September 2 (Wed) to 4 (Fri), 2026
- Venue:Â TaiNEX 1 and 2, Taipei
- Booth Number:Â N0592
- Schedule a Meeting:Â rtc.tw@rigaku.com
- SEMICON Taiwan Official Website
- Rigaku Exhibitor Booth Page
