Tokyo Electron has launched Prexa™ SDP, a new device prober built for testing singulated devices. The system is aimed at a fast-growing challenge in advanced semiconductor manufacturing, how to accurately screen Known Good Devices (KGDs) as packaging moves toward more complex 2.5D and 3D architectures for HPC and AI applications.
As advanced chips become more closely integrated, yield depends more heavily on finding reliable, unpackaged devices before they move deeper into the process flow. That makes singulated-device testing increasingly important.
But it also brings a tougher thermal challenge, since many of these devices generate significant heat and require precise temperature control during test.
Prexa™ SDP builds on the platform TEL has already proven with its Prexa wafer probers, while adding new thermal management technology designed specifically for high-heat devices.
Along with a GUI, high-precision contacts, wafer handling, and probe mark inspection, the system adds stronger heat absorption and an active thermal control head to support accurate KGD selection and stable device transport.
TEL says the launch supports its broader push to advance production and testing technologies for HPC and AI semiconductors, with a clear focus on improving yield and product quality.
Leadership Comment
“Testing is more important than ever for improving final yield in semiconductor products with advanced packaging technology,” said Yohei Sato, General Manager of ATS BU at TEL. “Prexa™ SDP combines TEL’s established wafer prober technology with proprietary thermal control to deliver the testing quality and system reliability needed for advanced packaging operations. We will continue developing innovative technologies and products to meet customer needs.”
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