Murata Manufacturing has announced a new collaboration with Synopsys that makes it easier for circuit designers to access high-performance simulation models. Now, users of Synopsys’ simulation tools can click directly from their software to Murata’s website and download the latest models without jumping between platforms.
The partnership covers two key Synopsys tools:
- Ansys HFSS™ for 3D electromagnetic field analysis
- Ansys Icepak® for thermal analysis.
This is a major step toward smoothing out the simulation workflow for electronic circuit designers. Murata also becomes the first company to offer passive component simulation models through Ansys Icepak.
As high-speed, high-capacity communications demand keeps rising, electronic circuit design has gotten significantly more complex.
Engineers now need to handle multiple physical phenomena in one design, from electromagnetic interference to heat generation in components. Catching these issues early is crucial.
If they slip through, they can lead to expensive redesigns, longer development times, and higher prototyping costs. That’s putting more pressure on component suppliers to provide ready-to-use, high-quality simulation models that work with the tools engineers already use.
Creating accurate models for electromagnetic and thermal analysis is tough because both electromagnetic behavior and temperature distribution change a lot depending on design conditions.
Murata’s vertically integrated approach, which covers everything from raw material development through manufacturing to final product processing, gives the company access to a massive proprietary dataset. This lets them build simulation models that closely match how components actually perform in real-world conditions.
The models work with Ansys 2026 R1. Ansys HFSS handles electromagnetic field analysis for Murata’s RF inductors and multilayer ceramic capacitors (MLCCs), while Ansys Icepak covers thermal analysis for Murata’s power inductors.
Murata plans to keep deepening its collaboration with Synopsys and expand its model lineup to support even more advanced and efficient electronic design going forward.
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