Eliyan Corporation has raised $145 million in an oversubscribed Series C funding round, reaching a $1 billion valuation as it looks to scale its interconnect technologies for next-generation AI infrastructure.
The round was led by Seligman Ventures, with participation from new and existing investors, including strategic backers Cisco Investments and Lumentum. As part of the deal, Seligman Ventures Managing Partner Umesh Padval will join Eliyan’s Board of Directors.
The fresh capital will support Eliyan’s expansion into the fast-growing electro-optical interconnect market, while accelerating development of its next-generation connectivity technologies, ecosystem partnerships, and manufacturing scale-up. The investment also reflects growing industry confidence in Eliyan’s approach, particularly as demand rises for high-performance, power-efficient AI systems.
Eliyan’s technology portfolio is focused on addressing one of the biggest challenges in AI infrastructure and i.e. data movement. As systems scale from single accelerators to rack- and cluster-level deployments, interconnect bandwidth, memory capacity, and power efficiency are emerging as key performance bottlenecks.
To tackle this, the company offers die-to-die, chip-to-chip, and rack-to-rack interconnect solutions designed for increasingly complex architectures, including advanced packaging, multi-package scaling, and high-bandwidth memory expansion.
At the core of its platform are silicon-proven NuLink PHYs and NuGear chiplet families, which enable efficient communication across compute, memory, and electro-optical domains. Eliyan’s move into optical interconnects builds on its electrical interconnect expertise and aligns with the industry’s shift toward co-packaged optics and heterogeneous compute architectures.
By combining electrical and optical connectivity, Eliyan aims to support the full spectrum of AI infrastructure from intra-package communication to large-scale, distributed systems helping overcome I/O, memory, and power limitations.
The funding follows increasing commercial traction, with leading hyperscalers, AI accelerator companies, and memory and infrastructure providers already evaluating or deploying Eliyan’s technologies.
Leadership Comments
“AI infrastructure is undergoing one of the largest architectural transitions in computing history,” said Ramin Farjadrad, CEO and Co-Founder of Eliyan. “As compute, memory, packaging, and networking become increasingly interconnected, traditional approaches to system connectivity are reaching their limits. Eliyan was founded to address these challenges at the architectural level. This financing, together with the support of leading strategic and financial investors, positions us to accelerate product development, customer adoption, and ecosystem expansion as we help enable the next generation of AI infrastructure.”
“We are thrilled to partner with repeat founders Ramin, Patrick, and Syrus as they build a leader in high-speed interconnect technology for AI infrastructure,” said Umesh Padval, Managing Partner at Seligman Ventures.
“As AI systems continue to scale, efficient electrical and optical interconnects that enable future scale-up and scale-out networks between compute and memory are becoming the performance-defining technologies of modern AI data centers. Eliyan has developed a differentiated architecture to address this challenge, combining deep semiconductor expertise and a scalable approach to the evolving needs of next-generation AI systems. The team’s exceptional technical depth, portfolio of more than 100 patents, marquee customer base, and validation from 12 leading strategic investors made our decision to lead this financing compelling. I look forward to bringing my board, semiconductor, and operating experience to help the company scale alongside the founding team,” added Umesh.
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