MacDermid Alpha Electronics Solutions is set to showcase its latest materials technologies at NEPCON Thailand 2026, taking place June 17 to 20 at the Bangkok International Trade & Exhibition Centre (BITEC). Widely recognized as a premier gathering for technology leaders and manufacturers, the event highlights innovation across one of the world’s most dynamic electronics manufacturing regions.
As electronic designs continue moving toward finer geometries, greater functionality, and rising thermal demands, particularly in automotive, high performance computing, and consumer electronics, materials are playing an increasingly critical role.
They are essential for enabling scalable production, maintaining process consistency, and ensuring long term reliability.
Featured Technologies at NEPCON Thailand 2026
Reliable Ultra Fine Feature Printing with ALPHA® OM 377
Miniaturized electronics are placing greater pressure on print precision and process control in high density surface mount technology (SMT) assembly. ALPHA OM 377 solder paste combines advanced print and reflow performance with ultra fine powder technology to support complex, miniaturized assemblies at production scale. It delivers reliable printing for components down to 008004, helping reduce assembly defects while ensuring consistent solder joint performance in fine feature applications.
Silver Free Assembly Performance with ALPHA® OM 100 SNCX® 07
Balancing manufacturing efficiency with long term reliability remains a key priority in high volume production. ALPHA OM 100 SNCX 07 solder paste offers SAC comparable reliability alongside up to 50% greater mechanical strain resistance. This enables stable processing, improved mechanical performance, and consistent assembly outcomes while maximizing overall manufacturing value.
Process Consistency for Through Hole Assembly with ALPHA® EF 6038HF
Through hole soldering continues to be critical for achieving process consistency and reliability in wave and selective soldering operations. ALPHA EF 6038HF liquid flux delivers broad process capability, enhanced thermal stability, and reliable hole filling performance. Its low residue, no clean chemistry supports consistent production outcomes and high pin testing yields in high volume assembly environments.
Superior Thermomechanical Reliability with ALPHA Innolot® MXE
Advanced assemblies demand materials that can withstand sustained thermal cycling and mechanical stress. ALPHA Innolot MXE solder paste provides proven thermal cycling performance from minus 40°C to 150°C, along with enhanced resistance to vibration and drop shock conditions.
It is well suited for high reliability applications where durability under stress is essential.
MacDermid Alpha Electronics Solutions continues to support electronics manufacturers across Southeast Asia through a combination of regional technical expertise, global manufacturing capabilities, and materials technologies designed for increasingly demanding assembly requirements.
Leadership Comment
“Thermal management, miniaturization, and increasing performance expectations continue to create new manufacturing challenges as package geometries shrink and assembly processes become more complex,” said Robbie Fu, Director, SMT Product Management. “MacDermid Alpha is focused on advancing material solutions that help manufacturers achieve greater process stability and long-term product performance. By combining technical innovation with cost-competitive solutions, we enable manufacturers to address evolving assembly requirements and strengthen their position in an increasingly competitive market.”
Visitors to Booth 9E11 are invited to engage with MacDermid Alpha technical experts on material selection and assembly approaches supporting strategic manufacturing objectives.
