MEMORY
AnalogAI Selects Microchip SST memBrain SAGE IP for Edge AI Processors
SST memBrain SAGE IP is already field-tested and deployed in robust 40 nm and 28 nm foundry processes using production-ready SuperFlash memory.
AnalogAI is bringing...
RRAM Endurance Soars 100 Times in Chinese Lab Breakthrough
The Chinese researchers RRAM endurance gains address one of the most stubborn technical barriers, but broader validation across wafers and production tools will determine...
Everspin, Teledyne HiRel to Expand MRAM in Aerospace and Defence Systems
Everspin Technologies and Teledyne HiRel Semiconductors have entered into a strategic partnership aimed at accelerating the adoption of Everspin’s magnetoresistive random-access memory (MRAM) in...
Polymatech Fires Up Automated Memory Line for AI Boom
Polymatech Electronics says its newly operational, fully automated memory module manufacturing line positions the company to serve rising demand across high-performance computing, enterprise, industrial...
AMD to Acquire Taalas to Strengthen AI Inference Roadmap
AMD has entered into a definitive agreement to acquire Taalas, a specialized AI inference silicon company, in a move aimed at strengthening its long-term...
NEO Semiconductor Unveils NEO.AI Platform to Break AI’s Memory Wall
NEO Semiconductor has announced the launch of NEO.AI, a next-generation memory platform designed to address two of the biggest challenges limiting the performance and...
Infineon 512 Mb NOR Flash Wins MediaTek Dimensity Auto Cockpit Spot
Infineon Technologies and MediaTek are teaming up to power more advanced, AI-driven experiences inside next-generation vehicles. As part of the collaboration, MediaTek has qualified...
Samsung Fires Back at SK Hynix, Micron Teases zHBM, 8x HBM5, 10x Density
Samsung aims to reclaim the high ground in AI memory by unveiling a new architecture that stacks high-bandwidth memory directly on top of AI...
Kioxia, SanDisk Set New QLC Density Record
Kioxia and SanDisk have unveiled their next-gen QLC 3D flash memory technology, saying it delivers up to a 60% increase in bit density over...
Montage’s MXC Trial Pushes Closer to Composable, Memory-Centric Architectures
Montage Technology has entered trial production of its CXL 3.2 MXC Chip, positioning it as a solution to growing memory bottlenecks in AI, cloud,...
Renesas Pushes DDR5 MRDIMM to 16,000 MT/s for AI Data Centers
Renesas Electronics Corporation is rolling out its (Gen 3) DDR5 MRDIMM chipset solutions, pushing server-class memory speeds to 16,000 MT/s. The move comes as...
