Ace Nanochem has finalized the development of three specialized material solutions targeting critical challenges in semiconductor fabrication like selective polishing for power devices, post-CMP surface cleanliness, and planarization for advanced packaging.
Building on an established supply chain with major semiconductor manufacturers in South Korea, the company is currently expanding deployment and technical collaboration with leading foundries in Taiwan and Japan.
Technical Product Overview
-
Poly-Si Slurry for Power Trench MOSFETs
-
Application: Polysilicon selective polishing.
-
Mechanism: Formulated to deliver high polysilicon removal rates while maintaining high selectivity to protect delicate gate oxides.
-
Performance: Mitigates common defectivity issues by reducing micro-scratches, particle generation, dishing, and erosion, thereby ensuring precise process control and optimal wafer topography.
-
-
Post-CMP Surface Treatment for Silicon Bare Wafers
-
Application: Post-chemical mechanical polishing (CMP) cleaning.
-
Mechanism: Modifies the surface wettability of bare silicon wafers immediately following the CMP process.
-
Performance: Actively inhibits particle adhesion and prevents subsequent contamination, ensuring the substrate meets the stringent surface cleanliness specifications required for downstream manufacturing steps.
-
-
Through-Glass Via (TGV) Slurry for Advanced Packaging
-
Application: Advanced semiconductor packaging utilizing TGV architectures.
-
Mechanism: Engineered for the simultaneous planarization of heterogeneous materials, specifically bulk copper, barrier metals, and bare glass substrates.
-
Performance: Delivers the critical global planarity and strict surface uniformity required to support complex TGV integration and advanced packaging yields.
-
Market Integration
To facilitate the adoption of these solutions, Ace Nanochem is actively pursuing process validation and technical partnerships with overseas foundries.
This expansion is supported by the company’s ongoing participation in regional industry forums, including SEMICON TAIWAN, to align product development with emerging global manufacturing nodes.
To Know More: CLICK HERE
