Agileo Automation has introduced Agil’EDA, a new software solution built around Equipment Data Acquisition (EDA) also known as Interface A to help semiconductor equipment manufacturers meet the growing connectivity demands of tier-one fabs and advanced packaging facilities.
As chip production becomes increasingly automated and data-driven, fabs now expect OEMs to support EDA in addition to traditional SECS/GEM interfaces.
Agil’EDA delivers on this need by cleanly separating control processes from data flows, ensuring that high-speed, structured data collection never interrupts critical equipment operations.
Designed for long-term deployment, the software fully supports the widely adopted EDA Freeze 2 (SOAP/XML) standards and is engineered for an easy transition to Freeze 3 (gRPC/protocol buffers), the next-generation EDA framework expected to launch in mid-2026. Agileo has already validated its Freeze 3 implementation during the SEMI Standards Meetings held in November 2024.
Security has also been built in from the ground up, with features like encrypted communication and authentication.
Agil’EDA can be deployed as a stand-alone solution that integrates with existing equipment software or as a pre-integrated 
component of Agileo’s  A²ECF-SEMI framework.
When combined with Agil’GEM  and Agil’GEM300, it forms a complete connectivity suite that helps equipment makers accelerate compliance and reduce time to market.
Leadership Comment
“The key value for OEMs is a fast adoption path to a future-ready EDA architecture,” explains Marc Engel, chief executive officer of Agileo Automation. “By integrating Freeze 3 requirements in Agil’EDA architecture from the start, we address OEMs’ current needs while preparing them for future semiconductor manufacturing requirements.”
