Reliability testing of Direct RDL (Redistribution Layer), a core semiconductor packaging technology based on 8-inch wafers, has been completed by SK Keyfoundry in partnership with LB Semicon.
This accomplishment increases the competitiveness of automotive semiconductor packaging and advances next-generation semiconductor packaging technology.
RDL is the term used to describe the insulating layers and metal wiring that are placed on top of semiconductor chips to facilitate electrical connections. Its main purpose is to strengthen the connection between the chip and the substrate while reducing signal interference in WLP (Wafer Level Packaging) and FOWLP (Fan-Out Wafer Level Packaging) procedures.
Outperforming rivals, the recently co-developed Direct RDL by SK Keyfoundry and LB Semicon supports power semiconductors with high current capacity.
With a wiring density that covers up to 70% of the chip area and a
metal wiring thickness of up to 15 ?m, the technology is appropriate for both industrial and mobile applications as well as automotive use.
With an operating temperature range of -40°C to +125°C, the solution specifically satisfies the Auto Grade 1 certification under the AEC-Q100 international automotive semiconductor quality standard, guaranteeing reliable performance in challenging conditions.
This makes the technology completely feasible for automotive products, unlike rivals. Furthermore, by offering a Design Guide and Process Development Kit, SK Keyfoundry is now able to provide a process solution that is customized to meet the needs of its clients, allowing for more affordable packaging, smaller chip sizes, and reduced power usage.
Utilizing SK Keyfoundry’s extensive knowledge of semiconductor processes and sophisticated production capabilities greatly reduced the development timetable, according to semiconductor packaging and testing expert LB Semicon.
The two companies successfully achieved optimum wafer-level Direct RDL formation by combining their own back-end processing technology with SK Keyfoundry’s foundry process expertise. This is anticipated to significantly increase production efficiency.
Leadership Comments
LB Semicon’s CEO Namseog Kim commented, “The joint development of direct RDL has served as an important milestone in strengthening the technological competitiveness of SK keyfoundry and LB Semicon.” He also added, “Through close collaboration between the two companies, we plan to establish a strong foothold in the next-generation semiconductor packaging market, built on high reliability.”
“The joint development with LB Semicon, the semiconductor packaging specialist, holds significant meaning as it demonstrates the successful integration of our company’s advanced and comprehensive manufacturing expertise into cutting-edge semiconductor packaging process development,” said Derek D. Lee, CEO of SK keyfoundry. “SK keyfoundry will continuously collaborate with LB Semicon, a leading company in semiconductor technology, to further evolve and position ourselves as a premier foundry with proven capabilities in delivering high-performance and high-reliability semiconductor solutions to the global market.”
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