MacDermid Alpha Electronics Solutions will introduce ATROX® CD 560-1, a zero-PFAS conductive die attach paste, at SEMICON Southeast Asia 2026, taking place from May 5–7 in Kuala Lumpur at Booth 2423.
Built for high-volume leadframe manufacturing, ATROX CD 560-1 gives semiconductor manufacturers a credible alternative to traditional silver-based die attach materials while also addressing growing concerns around PFAS and volatile silver pricing.
With silver costs continuing to swing, packaging teams are looking for materials that offer better cost stability without compromising performance.
ATROX CD 560-1 uses advanced copper-based filler technology to deliver that balance, combining dependable performance with pricing that is less exposed to silver market fluctuations. It also performs consistently across multiple leadframe surface finishes and is designed for stable, high-throughput dispensing.
Its low outgassing further helps reduce contamination risk and supports reliability, making it a practical choice for a wide range of semiconductor applications.
As semiconductor packaging capacity continues to expand across Southeast Asia, the need for scalable materials that fit smoothly into existing assembly lines is only growing.
ATROX CD 560-1 is designed with that reality in mind, supporting high-speed automated dispensing, flexible cure profiles, and consistent processing in leadframe workflows. Its zero-PFAS formulation also helps manufacturers address environmental and regulatory pressures more confidently.
At Booth 2423, MacDermid Alpha application engineers will showcase dispense strategies, needle selection, and integration methods aimed at improving takt time and first-pass yield.
Leadership Comment
“As PFAS restrictions accelerate across Asia and supply chain pressures remain high, customers need materials that support reliability, production speed, and cost stability,” said Senthil Kanagavel, Director, Standard Die Attach, Semiconductor Assembly, MacDermid Alpha Electronics Solutions. “ATROX CD 560-1 is designed to deliver a high-throughput, high- performance solution for leadframe packages. It gives manufacturers a practical zero-PFAS die attach option that can support high yield in demanding applications.”
Media and engineering teams can request technical data packages, sample kits, and dispensing optimization support at the booth or through MacDermid Alpha Electronics Solutions at macdermidalpha.com
