ELECTRONICS
Renesas Unveils the Microscopic SLG46801 GreenPAK for Next-Gen Wearables
As wearables like smart rings, fitness bands, and VR glasses pack in more features, finding room on the circuit board is becoming a major...
Toshiba Debuts High-Endurance SiC Module for Rail and Renewables
Toshiba Rolls Out Next-Gen dual SiC MOSFET Module for Heavy-Duty Industrial Equipment.
As industrial sectors like rail transport and renewable energy demand increasingly smaller yet...
MIKROE Ships New Spatial Anchors to Bring Real-World Objects into Apple Vision Pro
MIKROE has officially started shipping its Spatial Anchor S1 and Spatial Anchor R1, a new line of hardware designed to seamlessly pull physical objects...
BMW Taps ROHM Semiconductor for its “Neue Klasse” EV Platform
BMW is turning to ROHM Semiconductor to power the heart of its next-generation electric vehicles.
ROHM has confirmed that its advanced Silicon Carbide (SiC) chips...
TVP Exclusive – Dirac CEO Anders Storm on the New Era of In-Car Audio
For decades, automakers have tried to solve the acoustic challenges of a car cabin by cramming in more speakers and wattage. But in a...
Integrating A-PHY at the Sensor Level
Valens Semiconductor and onsemi Team Up to Bring High-Speed A-PHY Connectivity to Mainstream Automotive Camera.
Valens Semiconductor and onsemi are joining forces to build a...
ADI and Cadence Bring Neural Networks to the Driver’s Seat
The inside of your next car is about to sound radically different—and vastly more intelligent. Analog Devices, Inc. (ADI) and Cadence’s Tensilica IP Group...
Honeywell Report Warns of Massive Security Disconnect Across Critical Infrastructure
Critical infrastructure operators are living with a dangerous illusion of security. While nearly 9 out of 10 industrial executives believe their cyber defenses are...
onsemi Flips the Script on Power Hardware with Wafer-Level Integration
Engineers need to pack more electricity into increasingly shrinking spaces while somehow keeping heat, costs, and development times under control. Lately, onsemi unveiled a...
OMNIVISION Tackles Autonomous Driving Blind Spots with Next-Gen TheiaCel Image Sensor
Automakers developing advanced driver assistance systems (ADAS) and autonomous vehicles have a highly efficient new set of eyes. OMNIVISION has officially launched the OX08D30,...
FLAG Upgrades ECHO Subsea Route with Ciena’s 1.6T Optics to Boost US-Asia Connectivity
FLAG is supercharging one of the few direct digital routes between Singapore and the United States, bringing ultra-high-speed connectivity to a crucial trans-Pacific corridor.
The...