Infineon will present power solutions, a complete portfolio spanning Si, SiC, and GaN covering everything from the grid connection all the way to the processor core.
At PCIM Europe 2026 in Nuremberg, Infineon Technologies will lay out its full semiconductor stack for the next generation of power infrastructure covering everything from AI data centers and robotics to the rapid expansion of electromobility.
The company’s booth is in Hall 7, stand 470, where it will showcase a wide range of power system solutions built on silicon (Si), silicon carbide (SiC), and gallium nitride (GaN), backed by software, design tools, and cybersecurity know-how.
Here’s what stands out at Infineon’s PCIM 2026 demo:
Future-proofing power infrastructure
As renewable energy scales up, the grid needs to be more resilient to handle energy-intensive workloads like AI data centers and advanced manufacturing.
Infineon will demonstrate semiconductor technologies for efficient battery storage systems, UPS, solid-state transformers (SST), and solid-state circuit breakers (SSCB).
One key demo is an SST stack, along with SSCB components based on CoolSiC™ JFET technology that can isolate faults in microseconds delivering the robustness needed for future DC grids.
Powering AI from grid to processor core
AI workloads are driving a steep rise in data center energy demand, accelerating the shift to new power architectures like HVDC sidecars and DC microgrids.
Infineon will present power solutions, a complete portfolio spanning Si, SiC, and GaN covering everything from the grid connection all the way to the processor core.
The exhibit of power solutions includes power semiconductors, drivers, microcontrollers, and sensors for advanced power supply units, as well as solutions for battery backup units, intermediate bus converters, voltage regulation, and intelligent protection devices.
Shaping the future of electromobility
As the global leader in automotive semiconductors, Infineon continues to push electromobility forward. PCIM 2026 highlights include solutions for traction inverters, DC-DC converters, on-board chargers, and battery management systems.
Visitors can explore the “One Inverter, One Infineon” system solution, designed to boost drivetrain efficiency while optimizing space and cost.
Additional demos feature CoolSiC and CoolGaN™ power switches, the new EasyPACK™ S and CIPOS™ Prime modules, XENSIV™ sensors, and AURIX™ TC4xx microcontrollers.
Empowering robotics with physical AI
Robots are evolving into physical AI systems that can sense, think, and act in real time. Infineon will showcase semiconductor solutions for industrial and domestic robots, humanoids, and drones.
The demos highlight high-efficiency motor control and power management based on CoolGaN power devices, PSOC™ Control C3 microcontrollers, and XENSIV sensors enabling compact designs, precise control, and reliable operation in next-gen robotic applications.
Cybersecurity built in from the start
Security runs through all of Infineon’s focus areas. At PCIM, experts will discuss the upcoming EU Cyber Resilience Act and demonstrate how secured-by-design semiconductor solutions help customers meet compliance requirements while strengthening product differentiation.
Infineon will also contribute to the PCIM conference program and the various expo stages.
An overview of all presentations by Infineon experts is available at www.infineon/pcim.
Infineon at PCIM Europe 2026
PCIM Europe will take place in Nuremberg, Germany, from 9 to 11 June 2026. Infineon will present its products and solutions for decarbonization and digitalization in hall 7, booth 470.
Information about Infineon’s PCIM 2026 show highlights is available at, CLICK HERE
