As AI and high-performance computing push PCB and IC substrate manufacturing to their absolute limits, MacDermid Alpha Electronics Solutions is bringing new fabrication strategies to Taipei. The company is set to deliver four technical papers at the IMPACT Conference 2026, alongside two targeted presentations at the Tech X Total Solutions forum during the TPCA Show.
Right now, fabricators are under massive pressure to deliver finer features, denser interconnects, and flawless process precision. Consistent copper distribution and reliable via filling are no longer just performance targets, they are mandatory for scaling next-generation devices.
To break through these bottlenecks, MacDermid Alpha is detailing a slate of advanced manufacturing techniques. Their research dives into periodic pulse reverse (PPR) plating to drastically improve copper thickness uniformity across complex HDI architectures.
The sessions will also unpack new approaches to bottom-up via filling, immersion tin, advanced final finishes, and emerging through-glass via metallization, all geared toward maximizing yield and reliability in highly complex production environments.
Backing up this research is a targeted chemical and metallization portfolio. The PC 710 system brings enhanced copper throwing power to advanced HDI applications, while MacuSpec VF-TH 500 and AVF 700 handle demanding via-filling requirements for complex substrates. Rounding out the lineup is  Shadow® Plus, a graphite-based direct metallization process that gives engineers a robust alternative to traditional electroless copper setups.
Leadership Comment
“As the industry pushes the boundaries of PCB and IC substrate technology, manufacturing success increasingly depends on a deep understanding of metallization science and process integration,” said Martin Bunce, Line of Business Director, Secondary Metallization at MacDermid Alpha Electronics Solutions. we are sharing expertise that helps fabricators address increasingly complex manufacturing challenges and supports reliable, scalable production.”
Visitors can meet MacDermid Alpha technical experts at Booth #L513 during the TPCA Show 2026 in Taipei, to discuss application specific manufacturing challenges and explore advanced metallization solutions.
For more information, visit the event page.
