FPT Corporation has kicked off a landmark project in Vietnam’s tech ambitions, unveiling the FPT Advanced Semiconductor Testing and Packaging Plant on January 28, 2026, in Hanoi.
This fully Vietnamese-owned facility marks the nation’s first end-to-end testing and packaging operation, bridging critical gaps in the semiconductor value chain from design to commercialization.
Strategic Push for National Self-Reliance
The plant aligns with Vietnam’s Resolution No. 57-NQ/TW on science and technology breakthroughs, Decision No. 1131/Q?-TTg on strategic tech mastery, and Decision No. 1018/Q?-TTg targeting 10 advanced facilities by 2030.
It bolsters a complete ecosystem of research, design, manufacturing, training, testing, packaging, and market rollout propelling Vietnam deeper into global supply chains.
Attendees included Ministry of Science and Technology officials, Viettel leaders, FPT executives, universities, research institutes, and partners from Japan, South Korea, Taiwan, and beyond, plus alliances like Au Lac AI and Low-Altitude Economy.
This initiative tackles human resource goals too, training semiconductor pros toward a 50,000-strong workforce by 2030, with 35,000 in key manufacturing stages.
Phased Expansion and Cutting-Edge Capabilities
Phase 1 (2026-2027) launches at Yen Phong II-C Industrial Park in Bac Ninh with 1,600 sqm, featuring six automated testing lines (ATE testers, handlers), plus burn-in, reliability, and failure analysis zones.
Equipment meets ISO 9001/14001, IATF 16949, JEDEC, and AEC-Q100/101 standards for top reliability in IoT, automotive, and AI-edge chips.
FPT’s edge: Custom “Make-in-Vietnam” testing software for cost-efficient, tailored checks. Lines complete by National Reunification Day 2026. Phase 2 (2028-2030) scales to 6,000 sqm, adding 18 test lines, three reliability zones, QFN/QFP/DFN packaging, CSP/WLP, and advanced IC lines hitting billions of units yearly.
| Phase | Area (sqm) | Key Features | Capacity Target ? |
|---|---|---|---|
| Phase 1 (2026-27) | 1,600 | 6 test lines + reliability tests | Initial operations |
| Phase 2 (2028-30) | 6,000 | 18 test lines + advanced packaging (CSP/WLP/IC) | Billions of units/year |
Leadership Voices and Partnerships
FPT Chairman Truong Gia Binh declared: “Mastering semiconductors is Vietnam’s path to prosperity. We’ve got global talent; now we build our ecosystem. FPT delivers market-ready solutions, partnering with Viettel—wherever chips are made, we’ll test and package them for real-world use.”
Viettel CEO Lt. Gen. Tao Duc Thang added: “FPT’s plant completes ‘Make in Vietnam’ alongside our 2026 fab groundbreaking. It trains engineers domestically, curbing brain drain via state-private synergy per Resolutions 79 and 68.”
Dr. Nguyen Bich Yen, VSAP Lab Chair: “Vietnam acts decisively—FPT connects materials, design, packaging, testing, and talent, leading the ecosystem.”
Deputy Minister Bui Hoang Phuong: “FPT fills the packaging-testing void, turning Vietnamese smarts global.”
FPT Corporation sealed deals with Viettel (AI-edge SoCs on 28-32nm for drones/UAVs/cameras), Restar (R&D commercialization), Winpac (investments), and VSAP Lab (talent/packaging). FPT eyes 10,000 engineers by 2030 via “2+2” programs with Taiwan/South Korea, plus Da Nang/Hanoi centers. In 2025, it exported chips to Japan first.
This move cements FPT Corporation decade-long chip push power ICs, PMICs, AI SoCs positioning Vietnam as a regional hub amid booming global demand.
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