TI Redefines Isolation with IsoShield Power Modules

Texas Instruments just launched two new isolated power modules, UCC34141-Q1 and UCC33420 that squeeze up to 3x higher power density into the same space as discrete solutions. Powered by TI’s new IsoShield packaging tech, these deliver up to 2W while shrinking designs by 70% for data centers, EVs, and industrial gear. Catch them live at APEC 2026 booth #1819 (San Antonio, March 23-26).

What Makes IsoShield a Game-Changer

Power designers have long loved modules for saving board space and simplifying layouts. But as chips hit physical size limits, packaging innovation becomes the real hero.

TI’s IsoShield tech smartly co-packages a high-performance planar transformer with an isolated power stage, offering functional, basic, or reinforced isolation. It creates distributed power architectures that dodge single-point failures for functional safety compliance.

The payoff is the ultra-compact designs that still pack reliable punch, perfect for automotive, factory automation, and server racks needing rock-solid isolation.

Why Data Centers and EVs Need This Now

Nowhere is density more critical than next-gen data centers and EVs. Global server farms are exploding to handle AI workloads, demanding tiny power solutions that don’t compromise safety or efficiency.

IsoShield delivers just that, enabling sleeker power distribution for AI computing trays. In EVs, it means lighter converters that stretch range while hitting stringent safety standards.

TI’s Take (Kannan Soundarapandian, VP/GM High Voltage Products):

“Packaging innovation is revolutionizing power design. IsoShield gives engineers what they crave: smaller footprints, better efficiency, rock-solid reliability, and faster time-to-market. It’s TI pushing analog boundaries to solve real-world challenges.”

?Live at APEC: High-Power Demos

TI’s booth #1819 features these modules powering a 300kW SiC automotive traction inverter. You’ll also see:

• 800V-to-6V DC/DC board with GaN power stages for AI data center trays
• USB-C, humanoid robot, and sustainable energy reference designs

TI’s Power Module Legacy

TI’s 350+ power modules many rocking IsoShield and MagPack™ integrated magnetics have simplified designs for decades.

Check ti.com/powermodules and ti.com/IsoShield for specs, articles, and design files.

Pradeep Shenoy, TI computing power technologist, will also present “Reimagining Data Center Power Architecture” from 1:30 p.m. to 2 p.m. Tuesday, March 24, in Expo Theater 1.

For more information about TI at APEC, CLICK HERE

Availability

Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available.