MacDermid Alpha Electronics Solutions has launched ALPHA® OM-377, a no-clean solder paste built for ultra-fine feature printing in advanced electronics assembly.
The new formulation is aimed at manufacturers working with increasingly small components and compact assembly tolerances, where process control, yield, and long-term reliability are critical.
As devices continue to shrink across mobile, wearables, and other compact high-performance applications, the pressure to maintain defect-free production only gets higher.
ALPHA OM-377 is designed to help manufacturers meet those demands with strong performance in ultra-fine printing, including support for 008004 component sizes.
It Also Delivers:
- Consistent solder paste transfer on fine-pitch layouts,
- Better electrochemical reliability, Improved first-pass yield by reducing common defects such as Head-in-Pillow (HiP) and Non-Wet Open (NWO).
- The paste also offers reliable wetting on brass and nickel surfaces.
In production, that translates to more stable printing and reflow performance, better throughput, and tighter process control across high-density, low-standoff assemblies. Its no-clean chemistry leaves low post-reflow residue, while the halogen-free formulation supports current environmental and compliance requirements.
As electronics keep moving toward greater miniaturization and functionality, materials like OM-377 are becoming essential for scalable, high-volume manufacturing.
Leadership Comment
“Ultra-fine feature designs require consistent printing and reflow performance at production scale,” said Sam Foo, Regional Product Manager, Solder Paste. “ALPHA OM-377 is designed to help manufacturers protect yield, maintain process stability, and support reliable assembly performance in high-density applications.”
To Know More About ALPHA OM-377 and its Capabilities in Ultra-Fine Feature Assembly, CLICK HERE
