L&T Semiconductor Technologies (LTSCT) is stepping into the future of automotive chips by joining imec’s ‘Automotive Chiplet Program’ (ACP), a pre-competitive research initiative that brings together players across the global automotive value chain.
The program focuses on evaluating chiplet architectures and advanced packaging technologies that can meet automakers’ strict demands for performance, functional safety, reliability, and long product lifecycles, while also unlocking the flexibility, scalability, and cost benefits of chiplet?based systems.
For decades, automakers have leaned on semiconductors to power vehicle electronics.
But traditional monolithic SoCs are starting to hit their limits under the compute and bandwidth pressure from advanced driver-assistance systems (ADAS), software-defined vehicles (SDVs), and next-generation in-vehicle infotainment (IVI).
Chiplets, modular silicon blocks tuned to specific functions and connected via advanced 2.5D and 3D packaging offer a new path like higher performance per watt, faster time-to-market, and a more resilient, multi?supplier supply chain.
The Automotive Chiplet Program taps into imec’s world?leading expertise in 2.5D/3D packaging and its broad ecosystem spanning semiconductor and automotive players.
By joining ACP, L&T Semiconductor Technologies is reinforcing its ambition to position India as a meaningful contributor in the global semiconductor ecosystem.
The company will participate in shaping open chiplet standards and work alongside leading automotive and technology innovators to speed up the development of safer, smarter, and more sustainable vehicles worldwide.
Leadership Comment
Sandeep Kumar, Chief Executive – LTSCT, said: “Chiplets represent a fundamental shift in how performance and integration are delivered in automotive systems. As vehicle architectures become increasingly software-defined, modular and scalable hardware becomes critical”.
He further added: “Through the collaboration with imec and the ACP partners, LTSCT aims to help define the standards and reference designs that will drive the next generation of high-performance, energy-efficient automotive platforms. Our participation will emphasise safety-critical compute partitions, high-bandwidth die-to-die links and robust test/monitoring concepts from wafer to in-field operation. We intend to contribute practical viewpoints from productisation — covering qualification, diagnostics and lifecycle management in real automotive environments”.
“We are delighted to welcome LTSCT — India’s largest semiconductor product company — to the Automotive Chiplet Program”, said Mr Bart Placklé, Vice President of Automotive Technologies at imec. “Transitioning to chiplet architectures is prohibitively expensive if pursued by OEMs in isolation. Commercial viability depends on industry-wide alignment around interoperable chiplet standards that allow carmakers to integrate off-the-shelf and proprietary chiplets seamlessly into unique systems. The Chiplet reduces vendor lock-in, enhances supply-chain flexibility and improves energy and spatial efficiency — key enablers of more compact and sustainable vehicle platforms”, he added.
