ELECTRONICS
Integrating A-PHY at the Sensor Level
Valens Semiconductor and onsemi Team Up to Bring High-Speed A-PHY Connectivity to Mainstream Automotive Camera.
Valens Semiconductor and onsemi are joining forces to build a...
ADI and Cadence Bring Neural Networks to the Driver’s Seat
The inside of your next car is about to sound radically different—and vastly more intelligent. Analog Devices, Inc. (ADI) and Cadence’s Tensilica IP Group...
Honeywell Report Warns of Massive Security Disconnect Across Critical Infrastructure
Critical infrastructure operators are living with a dangerous illusion of security. While nearly 9 out of 10 industrial executives believe their cyber defenses are...
onsemi Flips the Script on Power Hardware with Wafer-Level Integration
Engineers need to pack more electricity into increasingly shrinking spaces while somehow keeping heat, costs, and development times under control. Lately, onsemi unveiled a...
OMNIVISION Tackles Autonomous Driving Blind Spots with Next-Gen TheiaCel Image Sensor
Automakers developing advanced driver assistance systems (ADAS) and autonomous vehicles have a highly efficient new set of eyes. OMNIVISION has officially launched the OX08D30,...
FLAG Upgrades ECHO Subsea Route with Ciena’s 1.6T Optics to Boost US-Asia Connectivity
FLAG is supercharging one of the few direct digital routes between Singapore and the United States, bringing ultra-high-speed connectivity to a crucial trans-Pacific corridor.
The...
OMNIVISION Brings Edge AI to Automotive Cameras with New OAX7700 Processor
OMNIVISION is drastically cutting the energy drain of automotive parking surveillance with the launch of the OAX7700, a new ultralow-power AI companion processor. The...
Meet The New High-Speed, Ultra-Low Power TMR Switch in a New TO-92 Package
Littelfuse is expanding its popular TX00 TMR Switch family with a brand-new option for design teams - the TX00AT314AMA Omnipolar TMR Switch Sensor.
The big...
Accelerate EV charger development with the EasyEVSE platform and RW612 wireless MCU
At electronica India 2026, NXP showcased its EasyEVSE Entry-level Development Platform based on the RW612 wireless MCU. This highly integrated solution is designed to...
IndieSemiC at SEMICON India 2026 Unveils Indigenous ISC-VEGA-SOM Module
In a major boost to India's semiconductor and IoT ecosystem, fabless semiconductor company IndieSemiC launched the ISC-VEGA-SOM at SEMICON INDIA 2026.
The new indigenous System-on-Module...
NeoCortec, Endrich to Showcase NeoMesh Wireless Tech at The Things Conference 2026
NeoCortec is heading to Amsterdam for The Things Conference on September 22–23, 2026. Exhibiting alongside its German distribution partner, Endrich Bauelements GmbH, at stand...
