Baya Systems and Openchip have announced a strategic partnership that brings together two teams focused on solving the real bottleneck in next-generation AI and high-performance computing. Openchip has licensed Baya Systems’ data-movement platform and Network-on-Chip fabric technology to deliver solutions optimized for the growing demands of intelligent compute.
This partnership strengthens Baya’s footprint in Europe, following the successful opening of its UK offices in Cambridge earlier this year.
The truth is that next-generation AI and HPC workloads are throttled less by raw compute power than by data movement. Breaking through the memory wall and achieving system-level scalability means hardware architects need to design, simulate, and optimize data movement with specialized interconnect fabrics much earlier in the design cycle.
Openchip will use Baya’s WeaveIP unified fabric to develop specialized intelligent compute systems for AI workloads. Baya’s WeaverPro FabricStudio platform helps Openchip rapidly
design and optimize complex RISC-V-based multi-chiplet systems to ensure efficiency, performance, and scale.
By modeling and validating data movement architecture before committing to physical silicon, Openchip cuts development risk, reduces time-to-market, and optimizes power-performance-area at scale.
Baya Systems and Openchip also reflects a shared commitment to the open RISC-V ecosystem, allowing Openchip to deliver tailored accelerator solutions without the constraints or steep royalties of proprietary architectures.
This milestone marks continued global expansion for Baya Systems. After opening its Cambridge office, Baya is actively evaluating sites for its first EU-based office to support its growing European customer base. Meanwhile, Openchip continues its rapid scale-up from Barcelona, with operational presence across Spain, Italy, Poland, France, Germany, and Ireland.
Leadership Comments
“The fundamental challenges facing AI hardware today—scalability, thermal efficiency and uncompromised performance—cannot be solved if interconnect is treated as an afterthought,” said Dr. Sailesh Kumar, CEO and founder of Baya Systems. “The communication layer between memory and compute is the critical connective tissue of the AI stack. Our collaboration with Openchip enables them to address data movement explicitly and early to build their state-of-art systems with the performance and efficiency the market now demands within the ever-shrinking time-to-market window.”
“Innovation in the modern semiconductor landscape requires tight collaboration between leading-edge IP and system architecture,” added Cesc Guim, CEO of Openchip. “Baya’s data-movement platform provides the architectural foundation we need to deliver scalable, next-generation computing platforms. We welcome Baya’s expanding presence in Europe and look forward to driving the future of RISC-V innovation together.”
