Integrated KGD Test Cell, UltraFLEXplus with Prexa SDP for AI, data center 2.5D/3D package manufacturing yield.
Teradyne and Tokyo Electron (TEL) to deliver an integrated test cell solution that screens known good devices (KGD) for chips used in AI and data center applications.
The solution pairs Teradyne’s UltraFLEXplus platform with TEL’s Prexa™ SDP (Singulated Device Prober). This gives fabless designers, foundries, and OSATs a production-ready path to high-quality device screening at multiple points throughout the advanced packaging flow.
AI and data center devices are increasingly using chiplet-based designs that integrate multiple die into single 2.5D or 3D packages.
A single defective die can compromise the entire high-value package. Adding KGD screening protects final yield, improves quality, and maximizes output.
Within the joint test cell, Teradyne’s UltraFLEXplus instruments coordinate with TEL’s Prexa SDP, which maintains device temperature and manages the high-power dissipation characteristics typical of leading-edge AI silicon. The result is a validated test cell designed to reduce integration risk for high-volume manufacturing.
Built on open ecosystem architecture, the solution gives customers flexibility across complementary probe cards, manipulators, and interface technologies. It can integrate with other probers or testers as needed, no locked-in dependencies.
By combining Teradyne’s UltraFLEXplus platform with TEL’s industry-leading Prexa SDP prober, customers access a robust, production-ready KGD screening solution.
This helps ensure advanced 2.5D and 3D packages achieve the reliability and performance required for next-generation AI and data center architectures.
The commercially available solution represents a significant advancement in meeting the rigorous demands of AI and data center device manufacturing. Teradyne developed it in collaboration with TEL, delivering a validated path from chiplet design to production-ready screening.
Leadership Comments
“AI device innovation is moving at an unprecedented speed, and our customers need dependable screening at every stage of advanced packaging,” said Shannon Poulin, president of the Semiconductor Test Group at Teradyne. “TEL’s industry-leading Prexa SDP, combined with Teradyne’s UltraFLEXplus, gives customers a production-ready solution that covers singulated device testing with the thermal precision, power density, and digital performance that today’s AI and data center devices require.”
One can visit TEL at booth 613 and Teradyne at booth 513, at SWTest, June 8-10, 2026, at the Omni La Costa Resort in Carlsbad, California.
