Navitas Semiconductor and Magnachip Semiconductor have struck a strategic partnership aimed at speeding up SiC adoption in high-voltage and ultra-high-voltage power markets.

Under the agreement, Magnachip will license Navitas’ GeneSiC Trench Assisted Planar™ technology to enter the HV and UHV SiC segments.
The license covers 1200 V, 2300 V, 3300 V and higher-voltage GeneSiC technologies, giving Magnachip access to Navitas’ established SiC device platforms for next-generation power conversion applications.
As part of the deal, Magnachip will also gain access to Navitas’ SiC supply chain and materials ecosystem, which should help it move into the market more quickly.
The technology is expected to be ported, qualified and eventually internalized at Magnachip’s fab in South Korea, allowing the company to build on Navitas’ technology base while establishing its own production capabilities.
The companies said the licensed technologies are expected to support energy and grid infrastructure, energy storage, industrial electrification, automotive and other high-power applications.
They also added that the agreement extends beyond SiC, with additional areas of collaboration expected to be announced later.
Leadership Comments
“This strategic partnership with Magnachip reflects our long-term vision to broaden GeneSiC adoption across high-voltage and ultra-high-voltage power markets,” said Chris Allexandre, President and CEO of Navitas. “By licensing our proven GeneSiC technologies and supporting Magnachip through our supply-chain and materials ecosystem, we are creating a path to scale advanced SiC solutions more rapidly while enabling a deeper, long-term collaboration between our companies.”
“This agreement opens an important new market opportunity for Magnachip in high-voltage and ultra-high-voltage SiC,” said Chae Lee, Chief Executive Officer of Magnachip. “The addition of GeneSiC technology complements our existing MOSFET and power semiconductor portfolio and positions Magnachip to serve customers that require higher efficiency, higher voltage capability and more reliable power conversion solutions.”
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