MacDermid Alpha Electronics Solutions will exhibit at PCIM Europe 2026 from June 9 to 11 in Nuremberg, Germany, at Booth 7-460.
At the show, the company will spotlight how its latest attach materials can help power electronics manufacturers improve reliability, reduce process variation, and scale production more effectively.
As automotive, industrial, and AI-driven data center applications continue to push for higher power density and faster switching speeds, manufacturers are facing tighter thermal limits and greater pressure to keep production stable and repeatable.
That makes bond line control, void reduction, and manufacturing consistency even more important for long-term power module performance.
At PCIM Europe 2026, MacDermid Alpha will highlight its expanded ALPHA® Argomax® sintering portfolio and ALPHA® TrueHeight® solder preforms. Both are designed to improve thermal and electrical performance while supporting more stable, high-volume manufacturing.
The company will also take part in the PCIM Europe technical program, sharing insights on electronics assembly solutions for emerging applications.
On the AI stage, John Hynek, Global Product Manager, will discuss how attach materials can help meet the uptime and reliability demands of AI and data center infrastructure.
In addition, Andreas Socarras, Senior Application Engineer, will present a poster session titled “Investigation of Large Area Soldering Using High Stress Assembly and Challenging Surface Coatings” as part of the PCIM Conference.
Leadership Comment
“Power electronics manufacturers need attach solutions that can deliver tighter process control and higher reliability without adding unnecessary complexity,” said Gustavo Greca, Line of Business Director for Power Electronics at MacDermid Alpha Electronics Solutions. “At PCIM, we will show how our latest materials can help customers improve manufacturing stability and support the next generation of power module designs.”
