AI servers demand ultra-efficient power solutions, and GaN Power Semiconductors are leading the charge amid fierce manufacturing competition. Industry leaders are ramping up production to meet exploding data center needs.
GaN’s Edge in AI Power Delivery
GaN outperforms traditional silicon with higher efficiency, faster switching, and compact designs ideal for power-hungry AI workloads.
In data centers, it cuts energy losses by up to 30%, enabling denser racks and lower cooling costs.
This makes GaN essential for scaling AI infrastructure without grid overloads.
Capacity Expansion of GaN Power Semiconductors Accelerates
Major players like Infineon, onsemi, and Texas Instruments are boosting GaN output through advanced fabs, including 300mm wafers for 2.3x more chips per batch.
onsemi’s vertical GaN technology logs1,200V for rugged AI and EV use, now sampling to key customers.
TrendForce projects GaN device revenue at $920M in 2026, up 58% year-over-year.
Intense Competition Reshapes Supply Chain
Infineon leads with a “SiC core, GaN expansion” strategy, targeting AI PSUs and inverters. Chinese firms like Innoscience and VIS challenge incumbents by entering Tier 1 AI suppliers, while STMicro and ROHM push integrated GaN for global markets.
Yole forecasts the GaN power market hitting $3B by 2030, fueled by AI, EVs, and renewables.
Market Projections and Challenges
The power semiconductor sector eyes $71.4B by 2031, with GaN grabbing share from SiC in datacenters amid China’s self-sufficiency drive.
Yet, risks like SiC oversupply and pricing wars loom, pushing innovation in hybrid Si/SiC/GaN PSUs. For AI operators, GaN promises sustainable scaling as workloads double every six months.
This GaN boom underscores power semis’ pivot to AI enablers—watch for fab investments defining 2026.
