In a significant push for India’s semiconductor ambitions, the ESSCI and Synopsys International Limited to tackle the growing talent gap in chip design and advanced electronics.
The Memorandum of Understanding (MoU), signed at ESSCI’s New Delhi office, focuses on building industry-ready talent through a mix of hands-on initiatives. These include intensive bootcamps, faculty development programs, and hackathons designed to better connect academic learning with real-world industry needs.
A key aspect of the collaboration is its alignment with national initiatives such as PMKVY, ISM 2.0, C2S, and ESDM 2.0. Together, ESSCI and Synopsys aim to deliver training programs that strengthen students’ practical skills and improve their readiness for careers in the semiconductor ecosystem.
The partnership will also bring in advanced design tools and platforms from Synopsys, supported by subject matter experts, to enable deeper technical learning in semiconductor design and engineering. Participants will benefit from specialized training modules, along with joint certifications upon completion.
As India ramps up its efforts to become a global semiconductor hub, ESSCI and Synopsys is expected to play an important role in developing the skilled workforce needed to support the country’s next wave of electronic innovation.
Leadership Comment
Welcoming the partnership, Madhvendra Singh, CEO, ESSCI, stated: “This collaboration with Synopsys is a cornerstone in our strategy to establish India as a global hub for semiconductor talent. By integrating industry-leading tools and global expertise into our skilling framework, we are ensuring that Indian students are trained on the same platforms used by the world’s top chip designers. Our goal is to create a seamless pipeline of ‘industry-ready’ engineers who can immediately contribute to the nation’s burgeoning ESDM ecosystem.”
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