Molex to acquire Teramount Ltd., an Israel-based company specializing in detachable fiber-to-chip connectivity solutions for Co-Packaged Optics (CPO) and silicon photonics applications.
Molex to Acquire Teramount, Expanding Its Optical Connectivity Portfolio for Next-Gen AI Data Centers
Teramount’s TeraVERSE® platform built on its universal photonic coupler and wafer-level, self-aligning optics offers a practical, serviceable interface between optical fiber and silicon photonics chips.
Recently showcased as part of Molex’s one-stop Co-Packaged Optics solution at OFC 2026, the technology enables faster data transfer rates while reducing power and cooling requirements, key advantages for large-scale AI and hyperscale data center operations.
Teramount’s passive, detachable coupling approach supports wider assembly tolerances and wafer-level manufacturing making it far more scalable than traditional active-alignment methods as Co-Packaged Optics moves toward mass production.
Molex plans to integrate Teramount’s capabilities with its own optical technologies and global manufacturing network to accelerate the delivery of next-generation TeraVERSE solutions.
With TeraVERSE now part of Molex’s comprehensive optical interconnect portfolio, customers gain broader support for their CPO and silicon photonics designs. Teramount will continue operating as a design and engineering hub in Jerusalem, backed by Molex’s worldwide optical expertise.
The transaction is expected to close in the first half of 2026, pending regulatory approvals and customary closing conditions. Goldfarb Gross Seligman is serving as Molex’s legal advisor, and Gornitzky & Co. is representing Teramount.
Leadership Comments
“Teramount’s TeraVERSE technology fills a critical gap in the CPO stack,” said Aldo Lopez, President of Datacom Solutions at Molex. “Its detachable, fiber-to-chip interface complements our optical portfolio perfectly and helps set the stage for mainstream CPO adoption. By combining Teramount’s IP and engineering expertise with Molex’s scale, supply-chain strength, and system knowledge, we’re giving customers a clear path to deploy scalable CPO at high volume.”
“We’re excited to join forces with Molex,” said Hesham Taha, CEO and co-founder of Teramount. “Together, we can turn Teramount’s innovations into a high-volume, serviceable fiber-to-chip interface that meets the demanding performance and energy needs of AI and hyperscale data centers.”
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