The Boson+ IQ Development Kit announced by Teledyne FLIR OEM, a division of Teledyne Technologies Incorporated. The all-inclusive solution enables integrators to quickly create edge AI capabilities using cutting-edge thermal sensing across defense, security, and industrial platforms by fusing reference hardware with PrismTM software.
The Qualcomm Dragonwing QCS8550 system-on-chip (SoC), which powers the Teledyne FLIR OEM AVP at the center of the package, achieves an industry-leading 50 trillion operations per second (TOPS) with a typical power demand of under 2.5 watts.
In order to deliver outstanding image clarity in demanding applications, its multicore design enables Prism AI object identification models and Prism ISP functions, such as denoising and super resolution.
The kit’s interface and carrier boards with three MIPI interfaces are designed for versatility and scalability, enabling developers to incorporate visible or other sensor types into their systems.
It offers a smooth development process from prototype to deployment and includes the Boson+ and Prism SDKs, hardware interface control documentation (ICD), and professional engineering assistance.
Future upgrades like Prism SKR and Prism Supervisor are compatible with the Boson+ IQ Development Kit, making it future-ready. While Prism Supervisor provides autonomous operation to specified way points via GPS or visual-based navigation (VBN) location technology, Prism SKR enables autonomous target identification and terminal guidance.
These software-enabled features can give mission-critical applications in industrial automation, security, and military more potent capabilities.
Leadership Comments
“The Boson+ IQ Dev Kit represents a major leap forward for integrators building smarter, more efficient thermal systems at the edge with AI particularly for autonomy applications such as aerial drones, loitering munitions, and ground-based robotics,” said Jared Faraudo, vice president of product management and programs, Teledyne FLIR OEM. “By combining our high-performance Boson+ thermal camera with Prism AI and ISP software on a cutting-edge Qualcomm compute platform, we’re enabling faster development cycles, industry-best image quality, and longer mission endurance with minimal power consumption.”
Experience the Boson+ IQ Development Kit in action at the Teledyne FLIR stand (#S3-110) during DSEI UK at ExCeL London, Sept. 9–12, one of the world’s premier defense and security exhibitions.
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