As E&R celebrates its 30th anniversary with major advancements in research and technology. Glass substrates as a key component of next-generation advanced packaging, Fan-Out Panel Level Packaging (FOPLP), along with their most recent laser and plasma technologies, and Raman inspection solutions for advanced packaging processes are just a few of the key themes that E&R will be showcasing at SEMICON Taiwan 2024.
Glass Substrate Solutions & Ecosystem
Using its in-house TGV technology, E&R established the E-Core System Glass Substrate ecosystem, a partnership of leading local suppliers of semiconductor equipment, vision and inspection equipment, semiconductor materials, and critical component makers. Together, they have created Glass Core processing, the fundamental technology for glass substrates and can be seen during the SEMICON Taiwan 2024.
A 515*510mm glass core sample, a joint alliance accomplishment that includes laser modification, wet etching, and seed layer sputtering, will be unveiled by the company to the public for the first time.
This is the first time local Taiwanese enterprises have released the results of their combined efforts.
Furthermore, E&R provides laser polishing and beveling that are especially made for glass laser cutting following ABF (Ajinomoto Build-up Film).
FOPLP (Fan-Out Panel Level Packaging)
For FOPLP (Fan-Out Panel Level Packaging) procedures, the company offers mature, mass-production equipment in sizes ranging from 300*300mm to 700*700mm.
This covers ABF drilling, laser marking, laser cutting, post-debond plasma descum, de-smear, laser debonding, and plasma cleaning after drilling. The equipment guarantees high-efficiency output with its exceptional warpage management capabilities up to 16mm.
Plasma Dicing – Small Die Dicing
The company provides a hybrid system with fine control over cutting channels between 10?m and 30?m, combining plasma dicing with laser grooving.
In addition to producing equipment, it offers an all-in-one tiny die dicing service that enables wafers to be processed into small dies with a variety of forms, including circles, hexagons, and MPR shapes, in order to satisfy a range of client needs.
The company has invited to check out the newest developments in cutting-edge packaging process technology at SEMICON Taiwan 2024, Booth #N0968, 4F, Taipei Nangang Exhibition Center Hall 1.
SEMICON Taiwan 2024 – E&R Booth Information
- Location: Taipei Nangang Exhibition Center Hall 1
- Booth Information: 4F, #N0968
- Date: September 4-6, 2024
- For further Info: CLICK HERE
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