ELECTRONICS
Littelfuse Launches 7 kW Automotive TVS Diodes With Ultra-Low Clamping
Littelfuse has introduced the TP7.0SMD-XC Series of automotive-grade TVS diodes, led by the TP7.0SMD24CA-XC. Built around advanced foldback technology, the series delivers an unusually...
Power Integrations Expands Billion-Unit CAPZero Line with Ultra-Low Power IC
Power Integrations just rolled out the CAPZero-4, the latest addition to their well-known line of X-capacitor discharge ICs. They actually pioneered this technology back...
VW and NXP Forge Strategic Zonal MCU Pact for 2027 SDVs
Ahead of the International Suppliers Fair (IZB) in Wolfsburg, Volkswagen Group and NXP Semiconductors have forged a strategic partnership that lays the physical groundwork...
Automotive Noise Suppression – The Silent Shift in EVs
The automotive industry is currently undergoing a massive paradigm shift. The gentle hum of electric traction motors is rapidly replacing the traditional mechanical roar...
Rambus, ChipAgents Accelerate Chip Design with Agentic AI
Rambus and ChipAgents are teaming up to push the boundaries of chip design using agentic AI. The partnership is comprehensive as Rambus is rolling...
Navitas Unveils 2300V SiC Modules to Power Next-Gen AI, Grid Infrastructure
Navitas Semiconductor is expanding its ultra-high-voltage (UHV) SiC portfolio with a new line of power modules built specifically to handle the heavy demands of...
HMS Networks to Host Virtual Engineering Day on CAN XL and Automotive Ethernet
HMS Networks is dedicating October 28 to the nuts and bolts of modern automotive networking with its virtual In-vehicle Communication Engineering Day.
Aimed directly at...
Microchip Expands L-Series with 50-krad Rad-Tolerant, Ultra-Compact LX-820 Oscillator
Microchip Technology has expanded its L-Series timing lineup with the new LX-820 Radiation-Tolerant Quartz Oscillator, a component engineered specifically for Low Earth Orbit (LEO)...
Matching Signal and Power Connectors to Robotic and Other High-Density Industrial Applications
- Barley Li, Applications Engineering Manager – Technical Content, APAC, DigiKey
Smart factories are becoming increasingly automated through decentralized intelligence and control, utilizing modular robotic...
Renesas Debuts Flagship 600MHz MCUs with Embedded MRAM
Renesas has officially leveled up its MCU lineup with the launch of the RX74M and RX74N. Hitting up to 600 MHz, these new flagship...
Infineon and NVIDIA Bring GaN to the Core of 800V AI Data Centers
Infineon Technologies is deepening its collaboration with NVIDIA to tackle one of the most demanding engineering challenges in modern AI data centers which is...
