NeoCortec will demonstrate its NeoMesh wireless mesh networking protocol for smart meters at electronica India, running 16 to 18 September at the BIEC exhibition...
The Chinese researchers RRAM endurance gains address one of the most stubborn technical barriers, but broader validation across wafers and production tools will determine...
UK-based interconnect manufacturer Harwin acquires KEC, a specialist in EMC interconnect backshells, glands and panel fittings, bringing the company’s products, operations and team into...
South Korea’s INFAC Corporation has developed a new 800V battery pack design for electric vehicles that integrates a high-power, isolated and regulated 800V-to-48V DC-DC...
– Barley Li, Applications Engineering Manager – Technical Content, APAC, DigiKey
The demand for artificial intelligence (AI) has rapidly increased datacenter energy requirements. To support...
Renesas Electronics has expanded its RZ/G Series with two new 64-bit general-purpose microprocessors designed to bring higher processing performance, low standby power, and fast...
Same Sky and its Thermal Management Group announced the expansion of its thermoelectric generator (TEG) modules product line. Utilizing the temperature difference between the...
Pickering Electronics has released new comparative test data showing its compact reed relays generate far less thermal EMF than rival parts, a key advantage...
Microchip Technology has introduced the SY757xx family of 1.2V-output LVCMOS clock buffers, targeting the growing demand for low-voltage clock solutions in high-performance FPGAs, SoCs,...