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Teledyne FLIR Secures Industry-First UL 2684 Listing for Thermal Fire Detection Cameras
Teledyne FLIR has landed an industry-first UL 2684 listing for its A40 and A70 (Axx-Series) thermal imaging cameras, officially clearing the hardware for use...
Renesas Debuts Industry-First Dual-Side Cooled 650V GaN
Renesas Tackles AI Data Center Heat with Industry-First Dual-Side Cooled 650V GaN Device.
As AI data centers push rack power limits from 120 kW toward...
Kosuke Akiyoshi Tapped to Lead Panasonic Industry Europe as Spatz Retires
Panasonic Industry Europe is undergoing a major leadership transition. After more than 27 years with the company and over a decade steering its European...
BOS Semiconductors Joins Arm Ecosystem to Scale Custom Silicon for Physical AI
BOS Semiconductors has joined the Arm Total Design for Physical AI ecosystem. Through its participation, BOS Semiconductors plans to expand its technology and business...
NX Group with ISM to Overhaul India’s Chip Supply Chain Logistics
IPPON EXPRESS HOLDINGS, INC. signed a memorandum of understanding (MOU) lately with the India Semiconductor Mission (ISM), an initiative overseen by the Ministry of...
Navitas Lands ALATTIS Contract to Bridge Critical U.S. Supply Gap in 10 kV SiC Tech
With the ALATTIS program underway, Navitas will now build on that foundation to shatter the 6.5 kV ceiling, securing next-generation 10 kV production entirely...
Former GlobalFoundries Tech Director Venkata Vanukuru Joins Axiro as VP
Axiro Semiconductor Taps Industry Veteran Venkata Vanukuru to Spearhead New Power Division.
Bengaluru-based Axiro Semiconductor is making a decisive push beyond its traditional RF roots,...
Resonac Targets 4x Die Yield Boost with Ultra-Large Wafer Format
The two-decade reign of the 300mm silicon wafer might be coming to an abrupt end, and Japan is positioning itself to own the next...
VIAVI Unveils Compact 100G CyberFlood CF50 for Enterprise Network Validation
VIAVI Solutions has rolled out the CyberFlood CF50, marking a significant footprint reduction for enterprise-scale network testing.
Billed as the industry’s smallest and lightest all-in-one...
Brandner Targets India-Europe Tech Corridor with New EV Roadmap
H.E. Ashish Kumar Sinha, the Indian Ambassador to Estonia, recently toured Brandner Electronics OÜ’s printed circuit board (PCB) manufacturing facility in Paide.
Polymatech-Backed Brandner Electronics...
Pulsiv and Delta-Matrix to Solve Heat Crisis in High-Power, In-Wall USB-C Charging
Pulsiv has struck an exclusive manufacturing deal with Delta-Matrix to mass-produce its next-generation USB-C power modules. The partnership takes aim at a rapidly growing,...
