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Polymatech Fires Up Automated Memory Line for AI Boom

Polymatech Electronics says its newly operational, fully automated memory module manufacturing line positions the company to serve rising demand across high-performance computing, enterprise, industrial...

Applied Materials, UC Berkeley Partner to Advance AI Chip Research

UC Berkeley alumni also work across Applied’s engineering, scientific and management teams, while the company continues to recruit from the campus. Applied Materials is bringing...

Abode Takes Smart Home Security Outdoors With New Sensors Range

Abode Systems is launching two weather-resistant additions to its security lineup, the Garage Tilt Sensor and the Outdoor Contact Sensor, built to monitor the...

Rev 2.0: Microchip Shrinks PolarFire Ethernet Sensor Bridge for Edge AI Robotics

Microchip Technology has rolled out Revision 2.0 of its PolarFire FPGA Ethernet Sensor Bridge, a production-ready board that leverages NVIDIA Holoscan Sensor Bridge (HSB)...

Vishay Launches Compact Y1 Safety Capacitors for EMI Suppression

Vishay Intertechnology has introduced a new series of AC line-rated ceramic disc safety capacitors designed for EMI and RFI suppression in industrial and high-voltage...

Teledyne FLIR to Showcase Multi-Layered Security Solutions at Security Exhibition

As security threats grow more sophisticated, organizations protecting critical infrastructure, commercial facilities and high-value assets are moving away from isolated security systems. Instead, they...

MIKROE Opens NECTO Studio to 10,000+ MCUs from 12 Vendors

Embedded developers now have a single IDE that spans more than 10,000 microcontrollers from 12 different silicon vendors, all inside MIKROE’s multi-architecture environment, NECTO...

Honeywell to Skill 3 Lakh Students in AI and Cybersecurity by 2030

Honeywell Technologies is ramping up its education push in India with a fresh commitment to equip more than 3 lakh students with future-ready capabilities...

Sony and TSMC Lock $6.3Bn Image Sensor Venture in Japan

Sony and TSMC are turning a preliminary handshake into a full-scale, multibillion-dollar push to build next-generation image sensors in Japan. The two giants are...

Rutronik Opens YAGEO Group MLCC Portfolio to Design Teams Across Europe

Rutronik has announced the availability of the YAGEO Group’s multilayer ceramic capacitor portfolio, giving design teams across Europe and beyond a broader selection of...

Engineers vs Oscilloscope Complexity – Practical Ways to Regain Control

Modern oscilloscopes are absurdly capable. They can capture gigasamples per second, decode half a dozen serial protocols in parallel, and trigger on events that...

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